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  • 學位論文

幾何形狀與內部結構影響熱導管效能之研究

A study of the effect of internal structure and geometric shape to the performance in a heat pipe

指導教授 : 蔡瑞益

摘要


隨著現在科技進步CPU與晶片製程改善,其運算速度及效能提昇,但相對電子散熱問題也會隨之而來,如何將集中於CPU晶片的廢熱迅速的傳導到熱交換的地方進行散熱,是散熱設計人員相當重要研究的一環。 本研究以實驗方法探討幾何形狀和尺寸的差異應用於熱導管之效能試驗與評估分析效能表現,針對三種不同熱管幾何形狀: 改變熱管直徑、熱管打扁厚度與熱管折彎角度進行研究與探討。藉由此三種不同幾何形狀,分析熱管在傾斜角度方向0度、30度、60度、90度對於散熱效益之影響。實驗時利用熱電偶量測各元件之溫度並計算其相對應的熱阻值,藉由熱阻值的高低做為散熱性能判斷的依據。同時,實驗晶片之發熱瓦數分別控制三種不同負載: 15W、30W、45W,探討熱管於不同發熱源條件下的性能。而熱管結構分別為燒結、溝槽及複合三種,熱管長度選用常見的經濟尺寸200mm。在幾何尺寸方面: 熱管直徑包含有6mm及8mm,熱管打扁厚度為2mm及4mm,熱管折彎部份包含折彎角度0度、30度、60度、90度,分別來探討熱管散熱模組的效能,並作數據分析。

關鍵字

折彎 打扁 熱管

並列摘要


With modern advanced semiconductor technology and improved process of IC production, CPU calculation speed upgrades much, but there are some issues to cool the cores. In order to reduce its operation temperature, how to dissipate the wasting heat from CPU to heat exchanger effectively is a obviously important topic for thermal engineers of electric equipments. In this study, performance effect of heat pipes is discussed from the different outer geometric shapes and sizes. The three controlled factors are as follows: the diameter, thickness and bending angles of the heat pipe. Besides, another coefficient is analyzed that cooling benefits from different tilting angles (0∘, 30∘, 60∘, 90∘) of the heat pipe. The corresponding heat resistance is calculated from experimental temperature data measured by thermocouples, and use it as the basis to determined thermal performance between different heat pipes. Meanwhile, electric heater is controlled at three different loadings: 15w, 30W, 45W, to investigate heat pipe performance under different heat source settings. Heat pipe length is set as 200mm, which is cost optimized length of it. Geometric dimension parameters are 6mm and 8mm for diameters of heat pipe, 2mm and 4mm for thickness of heat pipe. 0, 30, 60 and 90 degrees for bending angles. With these controlled parameters to test performance difference and analysis the results.

並列關鍵字

Heat-Pipe Bend Step

參考文獻


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[1] G. M. Grover, “Evaporation-Condensation Heat Transfer Device”, US Patent 3229759, Appl. 2, December 1963, Published 18 January 1966.S.B.

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