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  • 學位論文

利用梯形補償結構抑制差模信號線轉角之共模雜訊

Common-Mode Noise Reduction Using Trapezoidal Compensation Structure for Bend Discontinuities of Differential Transmission Lines

指導教授 : 薛光華

摘要


本論文針對微帶線與帶線的差模訊號線轉彎所產生之線段不等長,提出改善線段不等長產生之共模雜訊抑制方法,此結構在頻域的部分是使用3D全波模擬軟體HFSS進行模擬,在時域的部分則是利用ADS進行模擬。在頻域時觀察差模轉共模的模態波形,在時域則是觀察共模雜訊波形。此論文提供的抑制方法是利用梯形補償結構,增加不等長線段之走線長度,減少時序不同步所產生的共模雜訊,而設計梯形補償的方式與結構尺寸也是本論文的一大重點,藉由分析不同參數對於共模雜訊的影響,最終整理出趨勢圖表。

並列摘要


This paper investigates on generation and mitigation of common-mode noise for bend discontinuities of differential transmission lines in microstrip line and strip line structure. This paper provides methodology to mitigate common-mode noise. The structure in frequency domain simulated by 3-D full-wave simulator HFSS and in time domain simulated by simulator ADS. In frequency domain compared by differential-to-common mode conversion, in time domain measured by common-mode noise. The mitigation scheme provided in this paper is that using trapezoidal compensation structure which can reduce common-mode noise to increase transmission lines length. The design of trapezoidal compensation structure and structural dimensions are also a major focus of this paper. Analyze the impact of different parameters on common mode noise. Finally, the trend chart is sorted out.

參考文獻


[1]J. L. Knighten, N. W. Smith, J. T. DiBene II, and L. O. Hoeft, “EMI common-mode current dependence on delay skew imbalance in highspeed differential transmission lines operating at 1 gigabit/second data rates,” in Proc. IEEE Int. Symp. Quality Electron. Design, Mar. 2000, pp. 309–313.
[2]J.Q. Lou, X.X. Zhou, S. Li, Y.C. Shu, A. Bhobe, and J. Yu, “A Novel Differential Serpentine Delay Line to Reduce Differential to Common Mode Conversion and Impedance Discontinuity,” 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), June 20-23, 2017.
[3]G.H. Shiue, W.D. Guo, C.M. Lin, Member, IEEE, and R.B. Wu, "Noise Reduction Using Compensation Capacitance for Bend Discontinuities of Differential Transmission Lines", IEEE Transactions on Advanced Packaging, Vol. 29, NO. 3, August 2006.
[4]P. Sochoux, M. Hsu, A. Bhobe, and J. Yu, "EMI from SerDes Differential Pairs", DesignCon, 2009.
[5]W. Fan, A. Lu, L. L. Wai, and B. K. Lok, “Mixed-mode S-parameter characterization of differential structures,” in Proc. IEEE 5th Electron.Packag. Technol. Conf., Dec. 2003, pp. 533–537.

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