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  • 學位論文

碳化矽蕭特基二極體特性研究

Electrical Properties of Silicon Carbide Schottky Diodes

指導教授 : 魏拯華

摘要


本論文之研究是利用LPD以及退火製程,在碳化矽上成長良好的絕緣層。首先使用液相沉積法在低溫(<50°C)條件下將二氧化矽沉積在碳化矽基板上,再以金屬材料Ni/Al為碳化矽背面歐姆電極,以Al為二氧化矽層上之電極。最後在經過600°C、700°C退火處理後下,來進行氧化層之漏電流特性分析。 其次是在碳化矽磊晶片上,以三種不同的製作流程完成之元件。其中利用液相沉積法製作元件終止結構二氧化矽,以金屬材料Ni/Al來製作schottky 歐姆電極。藉以完成碳化矽二極體元件。並且分析元件在有無氧化層條件下之I-V特性,如此可以了解氧化層對崩潰電壓的影響。

並列摘要


In this thesis,we grow a good insulating layer on the silicon carbide (SiC) substrate by the liguid phase deposition (LPD) method. After adding the Al buffer layer and annealing at 700°C, the leakage current characteristics of this LPD SiO2 are became acceptable. In the second part, we use this LPD SiO2 on the termination region of the SiC diode to improve the performances of the diodes breakdown voltage(Vbd). After comparing the SiC diodes with or without oxide layer, we find the device with the oxide termination shows a higher Vbd.

參考文獻


[1]. W. Huang1*, T. P. Chow1,Y. Niiyama2, T. Nomura2 and S. Yoshida2, “730V,34mΩ-cm2 Lateral Epilayer RESURF GaN MOSFET”,Rensselaer PolytechnicInstitute, (2009),P29-32.
[2]. W. Huang1, T.P. Chow1, Y. Niiyama2, T. Nomura2 and S. Yoshida2 ”Lateral Implanted RESURF GaN MOSFETs with BV up to 2.5 kV”, Rensselaer Polytechnic Institute,(2008),P291-294.
[3]. Nariaki Ikeda, Syuusuke Kaya, Jiang Li, Yoshihiro Sato, Sadahiro Kato, SeikohYoshida,“High power AlGaN/GaN HFET with a high breakdown voltage of over 1.8 kV on 4 inch Si substrates and the suppression of current collapse”,Yokohama R&D Laboratories, The Furukawa Electric Co., Ltd.(2008),P287-290.
[4]. K. Tang1, Z. Li1, T. P. Chow1, Y. Niiyama2, T. Nomura2 and S. Yoshida2 “Enhancement-mode GaN Hybrid MOS-HEMTs with Breakdown Voltage of 1300V” Rensselaer Polytechnic Institute (2009),P279- 282.
[5]. W. Huang1, Z. Li1, T. P. Chow1, Y. Niiyama2, T. Nomura2 and S. Yoshida2 “Enhancement-mode GaN Hybrid MOS-HEMTs with Ron,sp of 20mΩ-cm2,Rensselaer Polytechnic Institute,(2008)”,P295-298.

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