本論文之研究是利用低溫液相沉積(Liquid Phase Deposition, LPD)在碳化矽(Silicon Carbide,SiC)基板上成長良好二氧化矽絕緣層,並在碳化矽基板上加入一層鋁薄膜作為二氧化矽絕緣層的催化劑,配合矽製程之退火條件(600~900℃,N2環境),找出最佳之成長加退火製程參數,改善LPD製程之均勻度。其次是在碳化矽磊晶片上,以兩種不同的製作流程完成之元件。其中利用液相沉積法製作元件終止結構二氧化矽,以金屬材料Cr、Ni來製作蕭特基(schottky)歐姆電極,藉以完成碳化矽二極體元件。並且分析兩種金屬材料的條件下之I-V特性,如此可以了解氧化層對崩潰電壓的影響。
In this thesis, a good silicon oxide is grown on the Silicon Carbide(SiC) substrate bythelow-temperature,Liquid Phase Deposition(LPD)method. After adding Al catalytic layer and tuning the post annealing temperature(600~900℃), the LPD oxide film show behave as a good insulating layer.Followed on the silicon carbide epitaxy to two different component of the production process completed,Making by liquid phase deposition in which termination structure silica component to metal Cr and Ni to make a Schottkyohmic electrode, Completion SiC diode device. And analysis of two metallic materials under conditions of I-V characteristics, so oxide layer can understand the impact on the breakdown voltage.