在電子封裝元件中,如何設計封裝體結構與調整製程參數,使連接電訊通路的銲錫接點強度達到設計需求,是製程中極為重要的研究課題。目前評估銲錫接點的機械強度最廣泛被應用之新方法,即為高速剪向推球測試JESD22-B117(2006),其規範指出推刀速度應落在0.01~1.0m/sec,此測試結果已可提供高速衝擊下銲錫接點的機械特性及破壞模式分析,然而,隨衝擊速度上升,銲錫界面的斷裂破壞模式比率亦會增加;再者,由於電子元件的製造以及應用中,往往會受到冷或熱的瞬間溫度變化之衝擊,亦容易造成球體界面的破壞,因此,研究環境溫度對銲點剪向衝擊破壞模式的影響將有其必要性。本研究主要發展針對銲錫接點之溫控效應高速剪向衝擊實驗方法並比較銲錫接點剪力的破壞模式;此外,亦使用高速攝影機(拍攝速度可達每秒鐘擷取五十萬影像張數),觀察銲錫接點受高速衝擊負載之破壞過程,最終發展有限元素模型,應用模擬的方式來探討銲錫接點受剪向衝擊下的力學行為,以及在高速形變下之銲錫材料組成方程式。本文提出的方法在高速衝擊問題上提供了有效的實驗方法流程與精確的數值分析工具。
One of the important issues of a lead-free solder joint package is to design proper layers of structure and adjust manufacturing parameters so that the electric performance and the strength of the solder joint could reach the design requirements. The mechanical integrity of solder ball joints under dynamic loading is generally evaluated by means of a JEDEC standard impact test at high speed (0.01 m/s to 1 m/s). Such tests result in a higher incidence of interfacial fracture than low-speed shear tests, and provide valuable insights into the load–displacement response and failure mode of the solder ball joint. Furthermore, interfacial cracking failure of the solders at great temperature variations is of significant concern for electronic assemblies that operate in harsh environments. Therefore, ball shear impact tests with environmental thermal effects would be set up to study the impact failure modes for the solder joints under different impact temperatures. Accordingly, the present study proposes a novel technique for evaluating the failure characteristics, high-speed impact strength and energy absorbance of the solders at the chip level within a temperature control system. In this research, a method has been proposed for observing the fracture phenomenon in solder ball joints under high-speed impacts using a high-speed framing camera that captures approximately 500,000 frames per second (fps). Also, computer simulation model of ball shear impact test will be developed to study the constitutive model under high rate deformation. As a result, these proposed approaches provide efficient experimental method and accurate numerical analysis tools for high speed impact problems.