半導體廠尺寸愈來愈縮小,不僅製程的難度加高,在量測及環境的控制,均挑戰各方的極限。國際半導體技術藍圖(International Technology Roadmap for Semiconductors, ITRS)預估至2010年關鍵尺寸將朝45nm邁進,而氣態分子污染(Airborne Molecular Contamination, AMC)控制為關鍵技術之一。 氣態分子污染物非常的微小,可能從污染洩漏源擴散到其他區域。文中以本廠實際改善為例,探討當異常發生時如何界定災區及在最短的時間排除污染,降低產能損失,期提供予各界參考。
As the geometry of semiconductor device continues to shrink, not only process but also measurement and environmental control become more difficult than before. International Technology Roadmap of Semiconductor (ITRS) predicts the critical dimension will go to 45nm in 2010 and airborne molecular contamination (AMC) will have an increasing detrimental impact on the device performance. Airborne molecular contaminants are much smaller than particle so that they can diffuse to large area from a leak. This article is to share some experiences in how to identify the contaminated area, to shorten the recovery time and then reduce its impact when airborne molecular contamination occurred.