The Cryptomeria, .Taiwan Paulownia and Wood Oil Tree were used as raw materials and the Urea formaldehyde resin was .used as adhesive (glue level 7% based on oven dried weight of particles), to make flakeboard and Waferboard. The low density raw material was more suitable to produce low density particeboard. The modulus of ruputure of flakeboard was approximately 9-77% higher than the waferboard, but the screw holding strength, thickness swelling and water absorption of this two types of particleboard showed insignificant difference'. The modulus of elasticity (MOE), tested by tress-wave-timer of nondestructive method, showed that the MOE of flakeboards have higher than the waferboards, besides those particleboards made by cryptomerta with density larger than 0.6g/cm^3.