粉末狀酚樹脂膠合劑應用於粒片板之製造

Manufacture of particleboards using Powdered Phenol-Formaldehyde Adhesives

劉正字(Cheng-Tzu Liu) ； 李文昭(Wen-Jau Lii) ； 邱儒慧(Ru-hey Chiou)

《林產工業》 14卷1期 (1995/03) Pp. 116-128

https://doi.org/10.6561/FPI.1995.14(1).9

摘要

本研究乃探討粉末狀酚樹脂合劑之合成及其應用於一般型粒片恆及方薄片型粒片板製造之可行性。由實驗室自行製備6種粉末狀酚膠及2種液體狀酚膠並探討其應用於粒片板製造時粒片型態、膠合劑型態、膠合劑合成時之酚／甲醛／氫氧化鈉（P／F／NaOH）莫耳比、反應時間等及製板時之混膠方式、用膠量、熱壓時間等對成板性質之影響。所得重要成果如下：1.應用於粒片板製造之粉末狀酌樹脂膠合劑以F／P莫耳比2.0及2.2，NaOH／P莫耳比0.2所合成者較佳，合成反應時間在135－195min時，較長反應時間者所製成板性質較佳。2.由粉末狀酚膠之DSC熱分析得知，約在50－55℃時開始出現吸熱峰，此為粉末狀樹脂吸熱熔融所引起，而約在145－150℃時出現放熱高峰，乃樹脂分子聚合硬化之溫度。3.粉末狀酚樹脂膠合劑所壓製之粒片板，其機械強度隨用膠量提高或熱壓時間延長而增大。4.使用P／F／NaOH之莫耳比1／2／0.2，反應時間195 min所合成之粉末狀酚膠壓製之粒片板性質優於液體狀所壓製者。5.兩種型態粒片比較時，則方薄片型粒片板所需用膠量較一般型粒片少，其靜曲強度等較一般型粒片板良好，但內聚強度則較差。

關鍵字

粉末狀酚樹脂膠合劑 ； 粒片板 ； 方薄片型粒片板

並列摘要

The objective of this study was to investigate how the board properties were influenced by the synthetic method of resin and board manufacturing conditions. The particleboards and waferboards were manufactured by using phenol-formaldehyde risin (PF) synthesized in the laboratory. The boards bonded with liquid adhesives, which acted as controls, were compared with the boards bonded with powdered PF resins. The results are presented as follows: 1. The mechanical properties of boards using the two higher F/P mole- ratio types of PF resins (2.0 and 2.2) were much better than those using the lower F/P mole ratio (1.8). The properties of the boards using the PF resin synthesized with the lower NaOH/P mole ratio(0.2) or with longer reaction time were much better too. 2. The endothermal peaks of DSC- thermograms at 50-55℃ were the absorption of heat of powdered PF resin and caused their melting, and the exothermal peaks at about 145-150℃ were their curing temperature 3. The mechanical properties of particleboards were increased when used much adhesive rate or longer hot-pressing time 4. The properties of particleboards using powdered PF resins produced by F/P/NaOH mole ratio as 1:2:0.2 and reaction time as 195 minutes were much better than those using liquid PF resins produced with the same condition. 5. The rate of adhesive needed in making waferboards were less than that used in making particleboards. The properties of waferboards were better than particleboards except for internal bonding strength.

並列關鍵字

powdered PF adhesive ； particleboard ； waferboard