Performance Testing of Loop Heat Pipes with Vapor Chamber in the Evaporator

結合蒸氣腔體於迴路式熱管的熱性能分析

王金樹(Chin-Shu Wang) ； 王瀅智(Ying-Chih Wang) ； 李世榮(Shah-Rong Lee)

《中國機械工程學刊》 30卷5期 (2009/10) Pp. 419-424

https://doi.org/10.29979/JCSME.200910.0007

摘要

本研究之目的在於發展一個具有長距離傳輸(2050mm)與高熱傳量(300W)之迴路式熱管(LHP)。其中蒸發器乃由蒸氣腔體(vapor chamber, VC)與補償室(compensation chamber, CC)所組成，並以3 mm厚的燒結層隔開。本文探討蒸氣流道的配置、LHP的擺置方向、工作流體充填率(fill ratio, F.R.)、毛細結構材料與熱負載等參數對LHP散熱效能之影響。由研究結果顯示，輻射狀蒸氣流道最有利於水平與垂直的擺放方向，且該LHP在垂直方向與F.R.=80%時有最低的熱阻表現。利用低熱傳導係數的材料作為毛細材料可抑制VC部分的熱往CC洩漏，如此可增強VC的沸騰能力。本研究所發展的LHP之最低熱阻(0.212℃/W)發生在熱負載為200W時，此現象顯示200W為LHP系統沸騰與冷凝平衡的最佳熱負載。

並列摘要

This work develops a loop heat pipes (LHP) with the advantages of long distance (2050 mm) transport capability and high heat removal capacity (up to 300W). The evaporator of LHP is constructed by vapor chamber (VC) and compensation chamber (CC), which is separated by a 3 mm-thick sinter layer. The experiment incorporates five parameters, including as vapor channel layout, orientation, filling ratio (F.R.), wick material and heat capacity. The study results demonstrate that flow resistance is successfully used to design the vapor channel layout. The LHP has better thermal performance in the verticality, and the optimal F.R. is 80%. A wick material with low thermal conductivity prevents the residual heat to leak into the CC, and hence the boiling efficiency and thermal cycle is enhanced. The minimum thermal resistance of LHP with radial channel layout is 0.212℃/W when the heat load is 200W. Therefore, the equilibrium between boiling and condensation established at 200W.

並列關鍵字

loop heat LHP ； vapor chamber VC ； evaporator