Analytical Model for the Assessment of Vertical Elliptic Vibration Assisted Grinding of Brittle Material

脆性材料垂直橢圓振動輔助磨削分析模型

陳登鈴(Deng-Ling Chen) ； 彭雲峰(Yun-Feng Peng) ； 施晨淳(Chen-Chun Shi)

《中國機械工程學刊》 40卷6期 (2019/12) Pp. 595-604

摘要

In the past, researches mainly focused on the feasibility of the vibration assisted grinding in machining some brittle materials and the mechanism study is still absent. In this paper, an analytical model is presented to interpret the material removal mechanism of vibration assisted grinding brittle material. The model investigates the cutting kinematics of single grinding grain and the stress condition alone the equivalent shear plane within the chip formation zone. The theoretical analysis combined with the experimental result show that the proposed analytical model can be used to explain the material removal mechanism of vibration assistance grinding of brittle material.

關鍵字

Elliptic vibration-assisted grinding ； Material removal mechanism ； Equivalent shear plane ； Brittle material ； Stress condition

並列摘要

以往的研究主要集中于振動輔助磨削某些脆性材料的可行性上，對振動輔助磨削機理的研究尚不多見。本文建立了振動輔助磨削脆性材料時材料去除機理的解析模型。該模型研究了單個磨粒的切削運動學和切屑形成區內等效剪切面的應力條件。理論分析和實驗結果表明，該分析模型可用於解釋脆性材料振動輔助磨削的材料去除機理。