Simulation Study On The Heat Transfer Rate Of Thermal Modules With Different Fin Array Modes

相異散熱鰭片排列散熱模組之熱傳效率模擬研究

陳柏安(Po-An Chen) ； 蔡瑞益(Ruey-Yih Tsai)

《中國機械工程學刊》 42卷3期 (2021/06) Pp. 255-261

摘要

This study uses Flotherm software to investigate the heat transfer rate of thermal modules with different fin array mode. A thermal management system addresses high-power issue in electronic chips. As the chip-power increases, corrective measures can reduce elevating temperatures. The chip powers and different thermal systems are compared including heat sinks and cold-fluid circulation systems. Integrating aforementioned systems can help evaluate each component's trends and clarify the results of the thermal system mechanism. When the power is increased to 45 W, the 15-pin heat sink is the optimal thermal system. A flat-type heat sink is recommended over a square-type heat sink. In addition, fixing the positions within the cold fluid system is the main focus of this study as it is closely related to the sufficient space for faster heat circulation; this implies that the closer it is to the chip center, the higher will be the chip temperature.

關鍵字

thermal simulation ； thermal management ； heat sink ； junction temperature

並列摘要

本研究主要分析高功率電子元件的散熱效果，探討FloTHERM用於改善熱場的數值解。熱管理系統將解決電子芯片中的高功率問題。隨著芯片功率的增加，比較芯片功率，包括散熱器和冷流體循環系統在內的不同熱系統。將散熱器和冷流體循環系統集成在一起可評估每個組件的趨勢，並闡明熱系統機制的結果。本研究之散熱模組在其條件下，可達到最佳冷卻效果，然而當瓦數上升時，散熱鰭片及水管位置不同會有明顯差異之結果，其最差與最佳之散熱參數條件可達5度差異。