R. F. magnetron sputter deposition of Pb3MgNb2O9(PMN) thin films on n-type (001) Si wafers in the ambient of Ar and O2 mixture is investigated in an attempt to search for a high permittivity dielectric material for capacitor application to Dram IC. The deposition process is optimized with process parameters including reaction pressure, substrate temperature, oxygen flux and R. F. power density. The microstructure and the electrical properties of the thin films are found strongly dependent on target composition and post annealing history. In order to obtain high permittiviy and low leakage, the thin films must be treated to contain mostly perovskite phase of small grains.