Thermal Dissipation Performance of a Heat Sink/Vapor Chamber Prepared by Metal Injection Molding Process

金屬射出成形散熱片與蒸氣盒之散熱性質研究

陳柏源(B.Y. Chen) ； 黃坤祥(K.S. Hwang) ； 王青志(C.C. Wang)

《材料科學與工程》 38卷1期 (2006/03) Pp. 49-55

https://doi.org/10.6409/JMSE.200603.0049

摘要

隨著電子產品微小化後，散熱問題已成爲電子產業之一大挑戰。因此，冷卻技術的研發已日形重要。本先導型實驗以射出成形製程製作散熱片(Heat Sink)以及含有鰭片之蒸氣盒(Vapor Chamber)，並研究其散熱性質。由實驗得知，在不施加保壓之射出條件下，可以得到完整之散熱鰭片，且鰭片之高寬比可達到17.6。而鰭片與底部燒結後之密度都在96%以上，此表示已無連通孔產生之顧慮，對於將熱迅速傳至鰭片之能力也較不受影響。在散熱性能方面，散熱鰭片之熱阻值大約爲1.156℃/W，而在Tj溫度爲70℃時，所能負荷的功率爲40W，而含有鰭片之蒸氣盒之熱阻值約爲1.046℃/W。相信再增加鰭片數目、增大風扇效率、加大鰭片之高寬比後，此第一代之蒸氣盒之熱阻值將可再大幅降低。

關鍵字

金屬粉末射出成形MIM ； 銅粉 ； 散熱鰭片 ； 蒸氣盒 ； 熱管理

並列摘要

The heat dissipation has become one of the major challenges in current electronic packaging due to the ever-increasing high current density and high power in new electronic devices. In this research, a copper heat sink and copper vapor chamber that contain cooling fins were prepared using the metal injection molding (MIM) technology, and their heat dissipation performances were evaluated.
The results show that with optimized processing parameters, particularly the holding pressure, fins with an aspect ratio up to 17.6 could be produced. After sintering, the densities of the fin and the bottom plate were about 96%. With only 32 fins and a small fan installed, the thermal resistance of the heat sink was 1.156℃/W, and the power dissipation was 40W when the junction temperature was at 70℃. The efficiencies of the vapor chamber that contained copper powder wick at the bottom and wire meshes on the top of the chamber, the thermal resistance was decreased to 1.046℃/W.

並列關鍵字

Metal Injection Molding MIM ； Copper Powders ； Heat sink ； Vapor Chamber ； Heat Dissipation