本研究以孟宗竹竹片為試材,含浸酣甲酸樹脂後,垂直堆積3~7層,熱壓製造15~35mm厚之竹層積板。以碳化溫度600~1000℃及持溫1~3hr製造炭化竹層積板(CLBB),並探討炭化條對炭化竹層積板於電場中電磁波遮蔽效應之影響。碳化溫度愈高,炭化竹層積板之碳化物收率愈低,試材厚度及持溫時間則與炭化竹層積板之電阻係數呈顯著負相關。碳化溫度愈高則電阻係數愈小,而導電性愈佳。本研究各碳化溫度所得之炭化竹層積板可曰為類半導體材料。試材厚度、持溫時間及碳化溫度分別與炭化竹層積板之電磁波遮蔽效應呈顯著和極顯著正相關。依電磁波遮蔽值區分,除少數者外,各炭化竹層積板均可達3~4級遮蔽效應。炭化竹層積板內晶體層間距離隨碳化溫度增加而縮小,繞射角度則隨碳化溫度增高而變大。
Laminated bamboos board of 15-35 mm thick, derived from 3-7 layers of phenol-formaldehyde resin pre-impregnated moso bamboo veneers were carbonized at 600 to 1,000 ¢XC, with an interval of 100 ¢XC, and with a retention time of 1-3 hours. The objective of this study was to examine the effects of the aforesaid carbonization conditions on the electromagnetic shielding of the various products. The carbides yield of the laminated bamboo board decreased with increasing carbonization temperature. The higher the temperature, the lower the yield. Carbonized laminated bamboos board displayed better electrical conductivity should it be produced at higher carbonization temperature. Specimen’s thickness and retention time showed significantly negative correlation with the resistivity of the carbonized laminated bamboos board (CLBB). CLI3B manufactured at conditions as designed could be categorized as semiconductor-like products. Specimen thickness, retention time, and carbonization temperature were significantly correlated with the electromagnetic shielding effect of the CLBB. The resistivity was, on the contrary, significantly negatively correlated with its electromagnetic shielding power. Most of the tested CLBB fulfilled the third and above level electromagnetic shielding demand and was classified as regular grade. The interlayer space in the crystalline structure of CLBB decreased, while the diffraction angle of the crystalline showed reverse effect.