銅無電鍍鎳熱處理後在3.5wt%NaCl之抗蝕性研究

Study on Corrosion Resistance of Heat-treated Electrolessly Nickel-plated Copper in 3.5wt% NaCl

陳宏生(H. S. Chen) ； 謝淑惠(S. H. Hsieh) ； 楊聰仁(T. J. Yang)

《防蝕工程》 14卷4期 (2000/12) Pp. 1-8

https://doi.org/10.6376/JCCE.200012.0001

摘要

銅試片無電鍍鎳後，經800℃，4小時，氬氣保護氣氛熱處理，在鍍層與底材界面會有銅鎳合金擴散層，擴散層厚度與無電鍍鎳鍍層磷含量有關，磷會抑制擴散層生成，所以磷含量較高之無電鍍鎳層，在熱處理時，鎳銅合金擴散層的厚度較小。無電鍍鎳層磷含量大於7 wt%時，爲非晶質狀態，熱處理後會有Ni及Ni3P結晶相析出，在3.5 wt%中性NaCl溶液中之抗蝕性較差金擴散層生成且厚度較厚時，腐蝕電位往較印態方向移動，有助於鍍支抗蝕性的提高。熱處理後複合鍍層整體耐蝕性，視結晶化無電鍍鎳層與銅鎳合金擴散層互補情形而定。

關鍵字

銅 ； 無電鍍鎳 ； 熱處理 ； 銅鎳擴散層 ； 3.5 wt% NaCl ； 抗蝕性

並列摘要

Copper nickel diffusion layer could be formed as electrolessly nickel-plated copper was heat- treated at 800℃ for 4 hours under Ar atmosphere. The thickness of CuNi diffusion layer is dependent on the phosphorus content of the electroless nickel coating. The presence of phosphorus inhibits the formation of CuNi diffusion layer during heat treatment. The higher phosphorus content of electroless nickel coating results thinner diffusion layer of CuNi alloy. As P% exceeds 7wt%, the as-plated electroless nickel coating is amorphous. The precipitation of Ni and Ni3P during heat treatment were observed and adversely to the corrosion resistance in 3.5wt% NaC1 aqueous solution. However, formation of CuNi diffusion layer at the interface of coating and substrate shifts the corrosion potential towards more noble direction. The overall corrosion- resistant properties of heat-treated electrolessly nickel-plated copper depend on the compensation effect of crystalline electroless nickel layer and CuNi diffusion layer.

並列關鍵字

Copper ； electroless nickel coating ； heat treatment ； CuNi diffusion layer ； 3.5wt% NaC1 ； corrosion resistance