脈衝電鍍參數對Ni-P合金耐蝕性之研究

The Influence of Pulsed Electroplating on the Corrosion Resistance of Ni-P Alloy

柯世宗(S. T. Ke) ； 李九龍(J. L. Lee) ； 葛明德(M. D. Ger) ； 胡文華(W. H. Hwu)

《防蝕工程》 18卷3期 (2004/09) Pp. 267-272

https://doi.org/10.6376/JCCE.200409.0267

摘要

電鍍Ni-P合金具有優異的耐蝕性與耐磨性，而其優異的耐蝕性與鍍層P量及微結構有明顯的關係，然而，一般文獻中對於Ni-P合金的探討仍侷限於鍍液成分的研究居多。本研究採用脈衝電流進行電鍍Ni-P合金鍍層，以電子微探儀（EPMA）、腐蝕電流量測及電化學交流阻抗（EIS）試驗分析來探討不同尖峰電流、負載循環和脈衝頻率對鍍層P含量與耐蝕性的影響。

關鍵字

脈衝電鍍 ； Ni-P合金 ； 耐蝕性 ； 電化學交流阻抗

並列摘要

Electrodeposition is a powerftil technology for making thin and nano-scale elements for a variety of applications. Presently, the electrodeposition of Ni-P alloy has been attracting much interest from many industries due to its high corrosion resistance. This study presents an investigation of the process of electrodeposion of Ni-P alloy using pulsed plating with the aim of finding the influence of pulse conditions on the corrosion resistance of the deposit. Since pulsed power allows us to control the reaction rate and allows time for these reactive species to reestablish the equilibrium concentration near the substrate when the power is off Our results did show that the phosphorous content and the corrosion resistance of deposit depends on current density, duty cycle and pulse frequency of the pulsed power.

並列關鍵字

Pulse plating ； Ni-P alloy ； Corrosion resistance ； Electrochemical impedance spectroscopy