運用CAIP於基板設計之檢測

Using CAIP for Inspection of Substrate Design

田方治(Fang-Chih Tien) ； 何宗達(Tzong-Dar Her)

《工業工程學刊》 20卷2期 (2003/03) Pp. 169-176

https://doi.org/10.29977/JCIIE.200303.0008

摘要

本研究之目的為應用電腦輔助檢驗(CAIP)之方法以簡化基板設計之檢驗與比對過程，並提高比對檢驗之正確性；此檢驗之過程藉由CAD之資料交換格式檔(DXF)作為媒介，以應用程式將所屬之設計層分類後，擷取各層中電路設計中線路(Trace)及導通孔(Via)之相關資訊，其中包含：線路相關座標位置、線路之寬度、導通孔之座標位置及半徑等；故首先將原設計及修改之電路設計圖轉換成DXF格式，再將所屬之特性擷取後與比對，並區分線路與導通孔等特性為三大類：(1)特性之位置關係及屬性完全相同，(2)特性之位置關係相同，但屬性不同，(3)特性之位置及屬性皆不相同。但由於修改之線路與導通孔於一定之允差範圍內，其電路之正確性及功能未受影響，故另產生一允差之知識庫簡化檢驗比對之程式。最後，更以不同顏色區分不同之特性，並產生比對後之DXF檔以利評估。

關鍵字

電腦輔助檢驗(CAIP) ； 資料交換格式檔(DXF) ； 基板設計

並列摘要

The objective of this research is to simplify the process of substrate design inspection and increase the correctness rate of comparison by means of computer aided inspection planning(CAIP) techniques. In this paper, we adopted DXF as a media and developed a feature extraction procedure to extract the relative information such as width(or radius) and coordinates of traces and vias. Therefore, the original and modified designs were first transferred into DXF formats, and the features of trace and vias were extracted. Then, we applied a comparison procedure to classify the extracted features into three categories: exactly same features, feature with same position but different attribute, and different features. However, the modified design of traces and vias within a certain range are still acceptable, a knowledge base was constructed to determine the tolerance for acceptable features. Eventually, a compared DXF with different colors marked features was generated by the system.

並列關鍵字

computer aided inspection planning ； DXF ； substrate design

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