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防止山藥切口黴菌生長之處理技術

Postharvest Treatment to Prevent Fungal Growth on Cut Surface of Yam

摘要


本試驗探討山藥禮盒包裝導致切口發黴現象之原因,並研究常溫保存與所需作業時間短之山藥切口處理技術。山藥禮盒包裝導致切口發黴的主要原因應為包裝環境內相對濕度大於75%所致,而與溫度的影響無關。試驗材料經風乾6小時後,於包裝內直接添加400 g之乾燥劑,可有效降低切口之發黴現象,但此方法較不適合實際使用。若使用2%油酸鈉配合75%酒精與1%次氯酸鈉處理山藥切口,亦可有效降低包裝內之發黴現象,並且具有所需之作業時間較短,不受氣候條件限制等優點。

關鍵字

山藥 油酸鈉 採收後病害

並列摘要


In order to prevent the fungal growth on cut surface of gift-packaged yam, experiments were carried out to understand the possible causes of fungal growth on cut surface of yam in gift package, easy treatments that can prevent these fungal growth when stored at room temperature. The fungal growth on cut surface of yam in gift package was likely due to the higher relative humidity (>75%) inside the package. Drying the cut surface with fan for 6 hours and enclosing 400 g of silica gel desiccant in the package could effectively decreased the fungal growth. However this method was not applicable in commercial utilization. Treatment of the cut surface of yam with 2% sodium oleate in 75% alcohol containing 1% NaOCl effectively prevented fungal growth. This treatment had the advantage taking less time and was not affected by ambient humidity, and was considered to have future application in the control of fungal growth on cut surface of gift-packaged yam.

並列關鍵字

yam sodium oleate postharvest pathology

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