微機電製程技術在高功率發光二極體之應用

Development of Micro-Electro-Mechanical System Technology for High-Power Light-Emitting Diode Applications

洪瑞華(Ray-Hua Horng)

《科儀新知》 163期 (2008/04) Pp. 87-92

https://doi.org/10.29662/IT.200804.0011

摘要

異於傳統發光二極體(LEDs)製程技術，本文敘述將微機電製程技術(micro-electromechanical-system technology)導入於LEDs製程中，採用晶圓接合或電鑄技術，將磊晶之基板替換成透光或具反射面且高散熱之功能性基板，並配合基板移除技術、鏡面製程與表面粗化技術。藉由此技術之導入，得以製作成高功率/高效率之LEDs，使其於背光或固態照明皆可擔任一舉足輕重之角色。

並列摘要

This paper describes how to introduce the micro-electro-mechanical system (MEMS) technology to the LEDs fabrication process for high-power LEDs application. It contains the wafer bonding, electroplating, mirror processing and surface roughening techniques. Using these MEMS technologies, the epitaxial growth substrate can be replaced by the transparent substrate or the substrate with mirror and high thermal dissipassion. It can result in LEDs with high power and high efficiency for the applications of backlight and solid state lighting.