超快雷射加工之研究與展望

Micro-Machining by Ultrafast Laser and Its Future Development

楊宏智(Hong-Tsu Young) ； 林芳妃(Fang-Fei Lin) ； 黃欣怡(Shin-Yi Huang)

《科儀新知》 164期 (2008/06) Pp. 20-26

https://doi.org/10.29662/IT.200806.0002

摘要

雷射加工具有熱解與光解兩種破壞機制，光解是以光子直接打斷材料的鍵結而去除材料，被去除的材料未歷經高溫熔解和汽化過程，加工精度和解析度勝過熱解加工的方式。而飛秒雷射的脈衝時間極短，易對材料產生光解機制，但目前國內飛秒雷射在加工方面的討論仍是有限。本研究即針對飛秒雷射與業界常用的Nd:YVO4雷射作比較與分析，期望對提升國內應用超快雷射加工之產品品質有所助益。

並列摘要

The material removal mechanism by laser micro-machining have two basic forms: pyrolysis and photolysis. The processing via photolysis removes materials in a way that photons break the interatomic bonds of the material directly, and the corresponding machining accuracy will be much higher than that via pyrolysis. The femtosecond laser has a characteristic of extremely short pulse, whose working mechanism falls in photolysis category. The research on femtosecond laser applications has not been widely carried out at present in Taiwan. This research was planned on the fundamental investigation and a comparison was made with the Nd: YVO4 laser which has been widely applied in industry.