高脈衝能量皮秒雷射

High Pulse Energy Picosecond Laser

Joyce Kilmer ； Santosh Pisharody ； 蔣克瑜(Brett Chiang)

《科儀新知》 180期 (2011/02) Pp. 73-79

https://doi.org/10.29662/IT.201102.0009

摘要

高脈衝能量皮秒雷射逐漸被應用於光電與半導體產業，可用於取代傳統機械切割。相對於奈秒雷射，高脈衝能量皮秒雷射（如圖1所示）是一種可用於微結構加工的利器，可處理範圍廣泛的材料樣品，包括脆性材料（玻璃、藍寶石）、金屬或複合材料。例如銅銦鎵硒太陽能電池的製程，在長脈衝雷射加工時會有熱影響，而產生不佳的結果，高脈衝能量皮秒雷射則可達成優異的加工結果。對於一般機械加工而言，不易達成大面積微米級的精密加工。皮秒雷射可以對於介觀尺寸的材料加工進行精密加工，可以利用將雷射離焦的方式，將雷射光束離焦，在能量密度可剝除材料所需的能量閾值下，達成大面積剝除材料的功能。在本文中，將介紹高脈衝能量皮秒雷射在材料加工上的應用及其優點。

並列摘要

High Pulse Energy (HPE) Picosecond lasers are effective tools for processing a wide range of materials to replace the traditional mechanical process in optoelectronic and semiconductor. Compared to traditional nanosecond laser exhibit chipping/cracking to metals or composite materials, high pulse energy picoseconds laser have good ability on novel thin film solar cell material, copper indium gallium selenide (CIGS), which suffer thermal deformation from long pulse laser processing. Mechanically machining meso scale dimensions in one axis, but micro scale in the other is traditionally difficult. HPE pslaser enable such ”Mesoprocessing” simply by defocusing, as the necessary ablation threshold is reached even when the beam is in the defocused state. In this article, we will introduce the benefit of this tool on the different material.