電容與電阻感測器與讀取電路系統整合設計

The Integration of the Capacitive and Resistive Sensors with the Readout Circuit Systems

蔡宗亨(Tsung-Heng Tsai) ； 曹育齊(Yu-Chi Cao)

《科儀新知》 212期 (2017/09) Pp. 26-39

摘要

本文介紹電容式、電阻式感測器與讀取電路之整合設計，並實現於單一CMOS晶片上之技術與研究成果。本文架構主要分四部份，首先是感測器簡介，說明電阻式、電容式感測器的運作原理；感測器與讀取電路整合製作技術於第二部份介紹，可透過微機電(micro-electro-mechanical systems, MEMS)技術進行感測器製作，而讀取電路則是由互補式金屬氧化物半導體(complementary metal-oxide-semiconductor, CMOS)技術完成，將兩者整合則為CMOS-MEMS技術，用於將感測器和讀取電路同時製作於同一晶片上；第三部份則是說明電容式、電阻式感測晶片的設計與製作流程；最後則是一電容式感測系統的實踐與研究成果。

並列摘要

The design and research of integration both capacitive/resistive sensors and readout circuit on a CMOS chip is described and organized as follows: First part is the introduction of capacitive/resistive sensors; Integration of sensors and readout circuits realizied by MEMS and CMOS technique is described in the second part; The third part describes the design flow of capacitive/resistive sensing chip; And the last part is the experimental results of a capacitive sensing chip.