應用六標準差手法改善覆晶載板（FCBGA）之電鍍均勻性

USING SIX SIGMA METHODOLOGY TO IMPROVE THE COPPER PLATING UNIFORMITY IN FLIP CHIP BALL GRID ARRAY

張庫旗(Ku-Chi Chan) ； 何應(Ying Ho) ； 鄭春生(Chuen-Sheng Cheng)

《品質學報》 26卷2期 (2019/04) Pp. 114-125

https://doi.org/10.6220/joq.201904_26(2).0003

摘要

隨著電子產品性能提升與體積輕量化，覆晶載板的線路精密度要求愈來愈高，而線寬與間距之設計則是日趨縮小。在此種情況下，高頻信號在線路傳遞過程中產生的阻抗，易受微影製程的線寬與電鍍製程的銅厚影響，當線寬或銅厚有分布不均時會造成雜訊與誤動作現象。本論文描述一個成功的改善專案，說明如何利用六標準差手法，決定垂直連續電鍍線設備之最佳參數，讓每片基板皆能經由相同程序生產，不僅減少成品間變異，且透過新式機構設計解決基板邊緣與相關圖形設計上的銅厚變異。此專案完成後，不僅可以使訊號之穩定性增加，同時滿足客戶新產品設計之需求。

關鍵字

六標準差 ； 覆晶載板 ； 銅厚變異 ； 電鍍均勻性

並列摘要

As electronic products have better performance and lighter weight, flip chip ball grid array (FCBGA) requires higher precision, and the design of line width and space is shrinking. In this case, the impedance generated by the high-frequency signal during transmission is susceptible to line width and copper thickness of lithography and Cu plating process. When the line width or copper thickness is unevenness, it will cause signal noise or malfunction. This paper describes a successful improvement project that shows how to use Six Sigma methods to determine the optimal parameters for vertical continuous plating equipment, so that each substrate can be produced through the same process, not only reducing the variation between finished products, but also through the new mechanism design to solve copper thickness variations between substrate edges and designated graphic designs. After the completion of this project, not only can the stability of the signal be increased, but also meet the needs of the customer's new product design.

並列關鍵字

Six Sigma ； flip chip ball grid array ； Cu plating uniformity ； copper thickness

參考文獻

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