THERMODYNAMIC ASPECT AND DIFFUSION MODEL ON INTERDIFFUSION OF LAMINATE STRUCTURE

交替疊層結構相互擴散之熱力學觀及擴散模式

王星豪(Shing-Hoa Wang)

《Journal of Marine Science and Technology》 8卷2期 (2000/12) Pp. 108-116

https://doi.org/10.6119/JMST.200012_8(2).0006

摘要

工程材料及電子材料有中，一直都無法避免非均質系統的事實存在現象，然而在工程應用中常因受到溫度影響，產生相互擴散，而導致Kirkendall孔洞形成及破製現象發生，本研究以週期式２元交替層狀結構類比凝固化偏析微結構或電子多層鍍膜結構，繼以熱力學觀點、擴散模式，能為應力梯度誘發應變強化擴散模式，討論相互擴散導致動態成份濃度梯度分佈變化，造成過量原子孔洞通量與Kirkendall void形成之關連性。

並列摘要

A non-uniform system such as microsegregation, heterogeneous microstructure and multiple-layer deposition of thin films, always exists in the engineering materials and the electronic materials for solid state devices. As a consequence of interdiffusion under high temperature exposure, The dynamical changes of compsition profiles and vacancies could lead to materials in earlier failure and reduce the life time of the component. Several theorectical fundamentals have been proposed on different aspects, Including(1)the void formation at the steepest concentration gradient;(2)thermodynamic view points of excess vacancy flux;(3)the model of interdiffusion for dynamic composition profile change; and(4)stress gradient induced strain enhanced diffusion, to systematically analyze the interdiffusion between layers in a laminate structure.

並列關鍵字

Interdiffusion ； kirkendall Void ； Thermodynamic ； Strain Enhanced Diffusion