In this paper, the author would like to disclose the development in transfer tool for high aspect ratio deep drawing brass tube with two stages at MIRDC. It included the blank layout, die design technologies and pilot run. For the two stages brass tube with high aspect ratio, there are many challenges in the front of tool makers. Especially for the deep drawing die, there are many deep drawing technologies need to develop, for example, multi-stages deep drawing and transfer technologies. These technologies can be applied to high depth-diameter aspect ratio brass tubing, for example, earphone terminals, cellular phone antennas, AV terminals etc. And the technique index is the 8:1 depth-diameter aspect ratio.