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化學機械研磨液(CMP)混合污泥再生利用於水泥砂漿之探討

Reuse of CMP Sludge from Semiconductor Industry as a Cement Mortar

摘要


半導體產業之晶圓製造與加工需使用化學機械研磨液(Chemical Mechanical Polishing, CMP),其製程所衍生之CMP混合污泥,潛存著有害人體健康之氟化鈣(CaF2)、有機物及奈米級SiO2微粒等,因此,CMP混合污泥於廢棄過程可能會對生態環境與人體健康造成危害,是否可使其既不危害環境,復可資源再生利用而一舉兩得,是殊值關切之問題。本文嘗試將CMP污泥脫水乾燥後,用以取代5~20 wt.%水泥製作成水泥砂漿試體進行抗壓強度試驗等,結果顯示CMP 混合污泥砂漿試體(實驗組)比純水泥砂漿試體(對照組)之強度為高,尤以取代10 wt.%者之抗壓強度約高達125%。其SEM之觀察結果呈現奈米粒子參與水化作用而消失之現象,而毒性特性溶出(TCPL)試驗結果亦遠低於法規值。似顯現該事業廢棄物可資源化再利用之潛能。

並列摘要


The waste sludge of chemical mechanical polisher (CMP) for finishing wafers in semiconductor industry is composed of hazardous materials such as nano-particles of SiO2, Al2O3, CaF2, and unknown organics. For the environmental protection of CMP waste disposal, transformation of the CMP sludge into a valuable material is a possible solution. The investigation of replacing the cement partially by CMP sludge to form a kind of cement mortar can be employed as a construction material as reported in this article. The mortar specimen using dried CMP sludge instead of 5-20% cement was conducted for its compressive strength. Result shows the compressive strength of CMP mixed with cement mortar specimen is higher than that of plain cement mortar specimen. Especially for the 10% cement replacement, the compressive strength rises up to 135% comparing with plain cement mortar specimen. It is observed from SEM that the nano-particles vanish due to hydration reaction. All of the TCLP results meet the environmental requirements. In addition, both the analytic results by XRD and FTIR display the Pozzolanic reaction would be occurred. Hence, the transformation of CMP sludge into construction material is possible and worthy for the environmental protection.

參考文獻


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