Using Single Image Multi-Processing Analysis Techniques to Estimate the Internal Bond Strength of Particleboard

單一影像多層分析技術應用在粒片板內聚強度之研究

林翰謙(Han-Chien Lin) ； 黃金城(Jin-Cherng Huang)

《台灣林業科學》 19卷2期 (2004/06) Pp. 109-117

https://doi.org/10.7075/TJFS.200406.0109

摘要

粒片板的內聚強度一直被視爲其最重要的膠合性能。然而傳統之內聚強度試驗，操作時手續繁雜且不經濟。居於此項理由，本研究採用非破壞性的單一影像多層分析(single image multi-processing analysis, SIMPA)技術，來評估粒片板內粒片間之膠合強度。該法是在板之側面（厚度方向）取得影像後，將影像經多層處理分析測得膠合劑覆蓋率(percent resin coverage, %)，再藉膠合劑覆蓋率與內聚膠著強度間之相關係數，間接估計內聚強度。本試驗用單層粒片板係依不同含脂率，密度及粒片尺寸抄製而成。所用的主要膠合劑爲酚膠(phenol-formaldehyde resin, PF)，部分試驗則使用三聚氰胺－尿素共縮合膠合劑(melamine-urea formaldehyde resin, MUF)。結果顯示，粒片板的內聚強度與其膠合劑覆蓋率的相關係數介於0.76至0.92間。因此應用本研究所設計之SIMPA技術可以快速地估計粒片板內聚強度。

關鍵字

單一影像多層分析(SIMPA)技術 ； 粒片板 ； 內聚強度(IB) ； 非破壞試驗(NDT) ； 膠合劑覆蓋率(%)

並列摘要

The internal bond (IB) strength is generally considered the most significant adhesive bond quality of particleboard. However, traditional ways to measure IB strength are time consuming. The objective of this study was to use single image multi-processing analysis (SIMPA) techniques as a nondestructive testing (NDT) method to quickly estimate IB strength of particleboard. In this method, photographs of the particleboard edge surface were obtained, followed by multiprocessing of each photograph to measure percent resin coverage (%). The IB strength was estimated or predicted from a strong correlationship between the percent resin coverage and destructively measured IB strength. Handfelt single-layer particleboards were manufactured with various resin contents, densities or particle sizes. A phenol-formaldehyde (PF) resin was mainly used in the study and a melamine-urea formaldehyde (MUF) resin was also used in part of the experiments. Results showed that correlation coefficients (r) between the percent resin coverage and IB strength were between 0.76 and 0.92. It is concluded that SIMPA can be used as a nondestructive method to quickly estimate the IB strength of particleboard.

並列關鍵字

single image multi-processing analysis (SIMPA) techniques ； particleboard ； internal bond (IB) strength ； nondestructive testing (NDT) ； percent resin coverage (%)