- 期刊
以檸檬酸鈉作為分散劑與螯合劑搭配無電電鍍法合成銀銅殼核結構粉體之研究
Sodium Citrate as a Dispersant and Chelating Agent for Synthesizing Cu-Ag Core-shell Particles: Using an Electroless Plating Method
摘要
本研究主要探討以檸檬酸鈉作為分散劑與螯合劑於液相中以無電電鍍之方式合成銀銅殼核粉末，並針對不同檸檬酸鈉與銀之莫爾比、不同檸檬酸鈉與銅之莫爾比對於銅核上鍍銀層之影響進行探討，其中當檸檬酸鈉與銀之莫爾比為1.09以及檸檬酸鈉與銅之莫爾比為0.25時，可於銅核上形成一緻密之銀層結構。由SEM的圖片與SEM-EDS之分析中可得知，本研究所合成銀銅殼核粉末之鍍銀層為一於銅粉表面均勻分佈的鍍層。此外針對抗氧化性之量測上，本研究所合成之銀銅殼核粉末再經過350°C4小時之熱處理後具有與純銀十分相近之導電性質，且於XRD分析圖譜中並未發現任何氧化銅（-1 1 1）面與氧化亞銅（1 1 1）面之特徵峰訊號。
並列摘要
Cu-Ag core-shell particles with homogeneous silver layers were synthesized using electroless plating of Cu particles, silver sulfate, and sodium citrate as a dispersant and chelating agent in an aqueous system. This study investigated the influences of varied [sodium citrate]/[Ag] and [sodium citrate]/[Cu] molar ratios on Ag coatings of Cu powders. Ag film formed a dense coating on the surface of the Cu powders at a molar ratio combination of [sodium citrate]/[Ag]=1.09 and [sodium citrate]/[Cu]=0.25. SEM images showed a uniformity of Ag coatings on the Cu powders. SEM-EDS analyses also revealed that the Cu cores were covered by Ag shells on the whole. Measuring the oxidation resistance of the Cu-Ag core-shell particles revealed closer resistivity (6.25×10^(-4)Ω‧cm); pure Ag (9.25×10^(-5)Ω‧cm) without CuO (-1 1 1) and Cu2O (1 1 1) peaks were detected after 4 hr of 350°C heat treatment.