仿溝槽式熱管結構之小型毛細泵吸環路熱性能探討

Thermal Analysis of Small-Scale Capillary Pumped Loop Imitates Groove Heat Pipe Inner Structure

林鴻文(Hung-Wen Lin) ； 林唯耕(Wei-Keng Lin)

《航空太空及民航學刊.系列B》 38卷2期 (2006/10) Pp. 89-95

https://doi.org/10.6124/JAAA.200610_38(2).03

摘要

毛細泵吸環路(Capillary Pumped Loop)運用在高空人造衛星及太空梭等熱控制元件技術已相當成熟。小型環路運用在電子元件冷卻卻無法有效突破，主要原因在於蒸發器內部結構無法有效吸收熱量。本研究設計小型CPL應用於1U伺服器。蒸發器內部設計以仿熱管之圓形溝槽結構，並置入高密度聚乙烯(H.D.P.E)做?毛細結構，藉以吸收大量工作流體。並探討環路儲槽有無對環路熱阻值的影響。實驗結果得知，在最佳化設計且填充量?72%時，加熱器在穩態下提供110W熱量時，其溫度可維持在80℃。而在儲槽有與無的比較中，兩者間系統熱阻R(下標 sys)平均偏差值?14%，環路熱阻R(下標 loop)偏差值更高達26.7%，証實了儲槽有效降低了熱阻。

關鍵字

毛細泵吸環路 ； 儲槽 ； 熱阻 ； 1U伺服器

並列摘要

The CPL is a high efficiency two-phase heat transfer device using the phase change of working fluid to transport heat from evaporator to condenser; it's a cyclic circulation pumped by capillary force. Since a CPL does not need any other mechanical device such as pump, it might be used for the thermal management of high power electronic component on spacecraft. This study presents thermal analysis of a small scale CPL with and without reservoir. The shape of evaporator and the porous structure uses semi-arc instead of square and cylinder structures. Experimental results also showed that CPL could remove 110W and keep the CPU temperature at 80oC. For a CPL with or without reservoir, the deviation values of the loop resistance R(subscript loop) and the system resistance R(subscript sys) are 26.7% and 14%, respectively. The results show the loop with reservoir results in a lower thermal resistance.

並列關鍵字

CPL ； Reservoir ； Thermal resistance ； One unit server