桌上型個人電腦產品具有生命週期短、技術變化快速等特性,因此唯有產品不斷創新設計與開發,方能有機會獲取消費者青睞。然而也因為追求高效率,相對地導致電子元件熱量持續升高,所以產品散熱設計分析,成了推出新的產品非常重要的一項環節。因此,本研究首先建構一現有電腦主機機殼,並進行數值模擬。其次,針對原機殼散熱缺失加以討論,並重新設計一款新型電腦主機機殼,以比較兩者之差異,進而提供未來設計工作者及企業主,在從事高科技數位產品設計開發工作時的參考,以減少設計者在設計開發新產品時的風險。研究顯示,透過散熱流場分析,可知道產品造型設計對於機殼內部熱流場的循環是有重大影響的,而本文所設計之新型電腦主機機殼,與原機殼散熱相互比對後,所設計之新型主機機殼不僅在外型創新之外,在散熱能力亦能達成需求。
For high tech digital products, design development is important as the products are in short life cycle and rapid technical changes. The main success to beat the competitors in volume for high technology industry is continuous design and innovative development. Because of high efficiency, such digital products cause higher heat of electronic components. Product design and heat dissipation are a major part of high tech products. In this study, commercial software is used to perform computations. The first step is to simulate the existing desktop P.C. case. Next, some drawbacks of the original design are identified, and redesign a new-type P.C. case. A comparison between the original design and redesign results is made to check whether the model correct. The results show, after internal flow field analysis, product appearance greatly affects internal heat dissipation circulation. After comparisons with prototype temperature performance of each case in simulation analysis result, the high tech digital products in this paper are proved to not only present innovation in unique appearance but also meet basic requirements of consumers in heat dissipation.