利用鉭作為熱電模組之擴散阻障層研究

A Study of Tantalum Barrier Layer Effects in Thermoelectric Module

陳奕瑞(Yi-Ray Chen) ； 葉建弦(Chien-Hsuan Yeh) ； 林俊凱(Chun-Kai Lin) ； 林育立(Yu-Li Lin) ； 趙文軒(Wen-Hsuan Chao)

《燃燒季刊》 79期 (2012/11) Pp. 51-61

https://doi.org/10.30041/CQ.201211.0005

摘要

擴散阻障層對於熱電模組的可靠性和使用壽命具有很大的影響，因此本研究利用噴砂處理熱電材料表面，以增加熱電材料和阻障層間之附著力，再依續濺鍍鉭（Ta）和鎳（Ni）於熱電材料表面。以鎳作為焊料與熱電晶粒之黏著層，將熱電晶粒焊接於銅電極後再進行200°C真空退火1小時。並量測在焊接和退火過程之熱電性能變化，其中包括電導率和Seebeck係數，由EDS的結果顯示鉭和鎳層可以有效阻擋銅和錫原子進入熱電晶粒。然而卻導致熱電晶粒之電導率略為下降。此外，熱電晶粒和銅電極間之熱阻導致溫差變大，因此在相同的端部溫度下導致等效的Seebeck係數變小。

關鍵字

熱電模組 ； 擴散阻障層 ； 碲化鉍

並列摘要

Diffusion barrier layer plays an important role to influence the reliability and life time of thermoelectric module. In this study, sandblast pretreated the surface of TE material to increase adhesive force between TE material and barrier layer. Tantalum (Ta) and Nickel (Ni) were sputtered to TE material in order. The nickel was be used the adhesion layer between Sn-Ag-Cu solder and TE legs. TE legs were soldered with copper (Cu) electrode and annealed at 200°C for 1 hours in vacuum. This investigation measured the TE performance, including electrical conductivity and Seebeck coefficient, during soldered and annealed processes. The EDS analyzer had shown that TE legs with Ta and Ni layer could prohibit Cu and tin (Sn) atom into Bi2Te3 alloys. Therefore, the electrical conductivity was slightly different in TE material during these processes. Nevertheless, due to heat resistance between interfaces induced the temperature difference between TE leg and Cu electrode, the effective Seebeck coefficient was reduced at the same extremity temperature.

並列關鍵字

Thermoelectric modular ； diffusion barrier ； bismuth telluride