銲錫接點界面反應生成介金屬形態及其動力學

Morphology and Growth Kinetics of Intermetallics Formed during the Interfacial Reactions of Solder Joints

莊東漢(T.-H. Chuang) ； 吳醒非(H.-F. Wu) ； 黃貴偉(K.-W. Huang) ； 顏秀芳(S.-F. Yan) ； 林修任(H.-J. Lin)

《界面科學會誌》 26卷2期 (2004/06) Pp. 71-81

https://doi.org/10.30020/JCCIS.200406.0001

摘要

在迴焊過程中，熔融銲錫與銲墊在其界面發生反應而達到接合目的，此一界面反應將造成銲錫與銲墊之間的相互擴散，並且產生反應生成物，此生成物大部分為介金屬化合物。因此界面介金屬的形成是銲錫潤濕與接合的基本條件，然而過度的介金屬成長將造成銲錫接點的脆化而導致破損。本論文主要是綜合台大材料所電子構裝實驗室所進行一系列銲錫界面反應系列研究之結果，經由金相觀察銲錫反應後的界面組織，歸納出各種不同類型的介金屬化合物形態，包括干貝狀、凹凸連續層、多面體塊狀、正方塊狀、平坦連續層及平行針狀，並討論其形成原因。此外亦量測介金屬厚度，以分析這些界面介金屬的成長動力學。

關鍵字

銲錫 ； 界面反應 ； 介金屬化合物 ； 形態 ； 成長動力學

並列摘要

The molten solder reacts with the solder pad at their interface during the reflow process for the purpose of attaining a sound joint. Such an interfacial reaction leads to the interdiffusion between solder and a solder pad and results in the formation of intermetallic compounds that make for most of the reaction products. Therefore, the appearance of intermetallic compounds is requisite for the wetting and bonding of the solder to its bond pad. However, excessive growth of the intermetallic compounds accounts for the embrittlement and failure of solder joints. This paper aims to summarize the research results of a series of solders obtained from the electronic packaging laboratory at the Institute of Materials Science and Engineering, National Taiwan University. Various types of the interfacial morphology can be characterized from metallographic observations of the interfacial microstructures after soldering reactions: scallop shape, crude continuous layer, polyhedron, cubic shape, continuous planar layer, and parallel needle. The cause for the formation of these types of intermetallic morphology will also be discussed. In addition, the growth kinetics for these interfacial intermetallics will be delved into through the measurement of the intermetallic thickness.

並列關鍵字

Solders ； interfacial reactions ； intermetallic compounds ； morphology ； growth kinetics