Palladium Nanoparticles and Its Application to Electroless Plating

近幾年來奈米科技的研究與應用蓬勃地發展，使得各種奈米材料被廣泛地應用於各種層面。目前已有許多研究顯示，由於奈米粒子具有表面積大、未飽和鍵結數多、活性佳等優點，因此常被應用於各種化學反應的催化劑。而合金奈米粒子由於其特殊結構與性質，往往比單一金屬更具有高活性之優點，因此本論文整理近十年來合成奈米鈀及其合金粒子之各種化學還原方法，並依照其化學反應性質，分為侷限空間法（confined space）及非侷限空間法（free space）。同時，本實驗室並嘗試以奈米鈀及銀鈀合金粒子做為無電鍍銅反應（electroless copper deposition）之活化劑（activator）。研究結果顯示，鈀及銀鈀合金粒子皆可以在界面活性劑的保護機制下形成奈米粒子，而在無電鍍銅的催化反應方面，銀鈀（1／1）奈米粒子之活性不但高於純鈀粒子，且其穩定性優於傳統之錫鈀膠體，故深具應用潛力。

關鍵字

奈米粒子；界面活性劑；無電鍍；活化；鈀銀合金

並列摘要

Mono- and bimetallic nanoparticles are of great interest due to their prominent chemical and physical properties. In this review paper, we focus on how to synthesize the nanoclusters of palladium and its alloy by chemical reduction approaches. These chemical synthetic methods can be classified as confined space and free space approaches according to the nature of protective mechanism. Besides, those alloy nanoparticles usually exhibit prominent catalytic properties owing to their tailored structures. Therefore, we apply these Pd and Ag/Pd nanoparticles as activator for electroless copper deposition. Those nanoparticles can be reduced by a protective surfactant, without adding any external reducing agent. The reducing power comes from the decomposition of surfactant, which forms reductive alcohol. As for their catalytic property, our study shows that the catalytic activity of Ag/Pd (1/1) nanoparticles is actually higher than that of pure Pd nanoparticles. Furthermore, these nanoparticles have successfully initiated the electroless copper plating and the copper thin film can be deposited and filled in microtrenches of 0.25um TaN/SiO2/Si pattern wafer. Accordingly, the Ag/Pd nanoparticles, which are more stable than the conventional Pd/Sn activator, could be a promising candidate as activator for electroless deposition.

並列關鍵字

Nanoparticle ； surfactant ； template ； electroless ； catalyst ； activator

國際替代計量

Palladium Nanoparticles and Its Application to Electroless Plating

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