- 期刊
COMPARATIVE STUDY OF STATISTICAL DISTRIBUTIONS IN ELECTROMIGRATION-INDUCED FAILURES OF AI/Cu THIN-FILM INTERCONNECTS
延伸閱讀
- 任哲民（2017）。A New Stochastic Solver for Complex-Structured Metal-Dielectric Interconnected Capacitance Extraction〔碩士論文，國立臺灣大學〕。華藝線上圖書館。https://doi.org/10.6342/NTU201702466
- Lin, Y. N. (2012). How network architectures and hubs affect efficiency of vertical and horizontal information propagations in neural circuits — a theoretical analysis [master's thesis, National Tsing Hua University]. Airiti Library. https://doi.org/10.6843/NTHU.2012.00441
- 蔡宗穎（2019）。Classification and identification of symptoms using two-dimensional convolutional neural networks with two-dimensional electrocardiographic features〔碩士論文，中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu201900809
- 蔡齊峻（2006）。A novel method of using continuous tribo-electrification variations for monitoring the tribological properties between pure metal films〔碩士論文，崑山科技大學〕。華藝線上圖書館。https://doi.org/10.6828/KSU.2006.00022
- Ke, J. H. (2013). Mechanisms of Electromigration-induced Intermetallic Dissolution and Metallization Consumption in Solder Interconnects [doctoral dissertation, National Taiwan University]. Airiti Library. https://doi.org/10.6342/NTU.2013.11083