An Analytic Expression of Thermal Diffusion Coefficient for the Hydrodynamic Simulation of Semiconductor Devices

TING-WEI TANG ； XINLIN WANG ； HAITAO GAN ； MEIKEI IEONG

《VLSI Design》 2001卷 (2001/12) Pp. 131-134

https://doi.org/10.1155/2001/51736

摘要

A new analytical expression of thermal diffusion coefficient D^T is derived. To the firstorder approximation, it is given by (1 +η)^(-1)(D/Tn) rather than (1-η)(D/Tn) where η=-(Tn/μ*)(□μ*/□Tn) and μ* represents the temperature-dependent bulk mobility. This new transport coefficient is implemented in our 2-D hydrodynamic device simulator and it seems to produce more reasonable results.

關鍵字

Hydrodynamic simulation ； Thermal diffusion coefficient ； Effective carrier energy ； Nonlocal mobility model