聚亞醯胺／氮化硼奈米複合材料

Polyimide/Boron Nitride Nanocomposites

曾怡享(I-Hsiang Tseng) ； 江仁吉(Jen-Chi Chiang) ； 林信全(Hsin-Chuan Lin) ； 蔡美慧(Mei-Hui Tsai)

《化學》 70卷1期 (2012/03) Pp. 31-38

https://doi.org/10.6623/chem.2012004

摘要

本文主要回顧目前國內外對於聚亞醯胺(polyimide, PI)與氮化硼(BN)的複合材料的相關文獻，並加入本實驗室目前對針對聚亞醯胺/氮化硼複合膜的研究成果。由於氮化硼具有優異的導熱性，因此其廣泛的被添加於高分子材料中以增加其熱傳導性，以達到目前尖端工業或電子產業對材料的高功能性需求；聚亞醯胺由於具有極佳的耐熱性與機械強度，若再提升其熱傳導性能，將可作為軟性電子基板、耐熱塗層、背光板等高散熱需求的材料。本研究選用傳統的高耐熱性聚亞醯胺單體組合，分析添加不同粒徑組合未改質的氮化硼於聚亞醯胺所製成之複合薄膜的機械與熱性質變化，並比較添加鈦偶合劑(2-((2-aminoethyl)amino)ethoxy)(isopropoxy)titanium)改質的氮化硼的影響。研究結果顯示，添加50 wt%兩種不同BN粒徑(4μm與15μm)的聚亞醯胺複合膜，將可同時達到極低的熱膨脹係數(coefficient of thermal expansion, CTE, 14 ppm/°C)及極高的熱傳導係數(thermal conductivity, k,0.75 W/mK)，而此複合膜中所含的BN粒子組合若再經過改質後，則可得更低的CTE (12 ppm/°C)及更高的k值(0.86 W/mK)，顯示此PI與改質BN間的作用力增加而複合膜具有極佳的尺寸安定性與熱傳導能力，同時此複合膜又具有足夠的機械強度與耐熱性，因此顯現其具有應用於多層軟板的潛力。

關鍵字

聚亞醯胺 ； 氮化硼 ； 導熱係數 ； 奈米複合材料

並列摘要

This is a review article related to polyimide (PI) and boron nitride (BN) nanocomposites. The recent research results about PI/BN composite films in our group are also presented. Highly thermal conductive BN has been extensively distributed in polymeric materials to improve the thermal conductivity of the composites for advanced applications. Thermally conductive PIs with intrinsic thermal stability and mechanical strength are potential materials for microelectronic or lighting industries where efficient heat dissipation is essential. In this study, highly thermal stable monomers were selected for PI synthesis. The effects of surface modification and addition ratio of BN on the thermal and mechanical properties of PI/BN nanocomposites were investigated. The results show that the best combination of BN particles in PI/BN nanocomposites to obtain highest thermal and dimensional stability simultaneously is 50 wt% of BN particles containing 30 wt% of BN (4 μm) and 70 wt% of BN (15 μm). This PI/50 wt% BN4(30)15(70) nanocomposite has a thermal conductivity (k) as high as 0.75 W/mK and a CTE as low as 14 ppm/°C. The surface modification of BN with 2-((2-aminoethyl)amino)ethoxy)(isopropoxy)titanium enhances the interaction between PI and BN that the thermal and dimensional stabilities are further improved. The thermal conductivity (k) is as high as 0.86 W/mK and the CTE is as low as 12 ppm/°C for PI/BN nanocomposite containing same ratio of surface modified BN particles. Combined with the excellent mechanical and thermal properties, the obtained PI/BN nanocomposites are potential materials for multilayer flexible printed circuit boards.

並列關鍵字

Polyimide ； Boron nitride ； Thermal conductivity ； Nanocomposite