超快雷射多層複合基板切割技術

Ultrafast Laser Cutting Technology for Multi-Layer Composite Substrates

陳園迪 ； 蔡武融 ； 劉松河

《機械工業雜誌》 419期 (2018/02) Pp. 17-25

摘要

多層複合基板切割技術廣泛的被使用於面板製程之玻璃切割與半導體製程之晶圓切割。行動穿戴式裝置的需求，使得高強度之多層複合基板成為未來的發展趨勢，為了建置此類新基板，更先進的切割技術之導入是勢在必行。雷射運用於多層複合基板切割其長時加工之穩定性高，由於切割道寬度很小，因此單片晶圓可切割出更多顆晶粒，因此提高生產效率。本文介紹雷射切割技術、雷射隱形切割技術，內容包含硬脆材料與多層複合基板之加工成果。最後，並介紹工研院投入超快雷射多層複合基板切割技術之開發成果。

關鍵字

超快雷射 ； 多層複合基板 ； 超快雷射切割

並列摘要

Multi-layer composite substrate cutting technology is widely used in the glass panel cutting process in TFT-LCD and the wafer cutting process in semiconductor manufacturing. The demand for wearable devices has led to the development of high-strength multilayer composite substrates in the future, and the introduction of more advanced cutting techniques is imperative in order to build such new substrates. When laser is applied to cut multi-layer composite substrates, it has advantages of high stability in long-time processing; and due to the small dicing width, more chips can be yielded from a single wafer, thus increasing production efficiency. This article introduces laser dicing and stealth laser dicing technology, including hard and brittle materials and multi-layer composite substrate processing results. Finally, we introduce ITRI achievement in ultra-fast laser technology for cutting multi-layer composite substrates.

並列關鍵字

Ultrafast Laser ； Multi-Layer Composite Substrates ； Ultrafast Laser Cutting