微波介質陶瓷金屬化之製作與研究

Development and Study of Metallization for Microwave Dielectric Ceramics

林政毅 ； 林昭志 ； 高端環 ； 黃萌祺 ； 李遠明

《機械工業雜誌》 426期 (2018/09) Pp. 15-22

摘要

本研究藉由雷射圖案化與無電鍍銅方式將微波介質陶瓷金屬化，整個金屬化的過程溫度相對其他製程方法如：低溫共燒多層陶瓷(Low Temperature Co-fired Ceramics, LTCC)、直接覆銅接合技術（Direct Bond Copper, DBC）製程低，顯示此技術能夠有效地降低能源的損耗和大幅地減少冷卻設備的成本。另外，此製程相較於傳統銀漿燒結方法，孔壁內的金屬不會有短路或附著不完全的現象發生。因此每批陶瓷雷射金屬化完成後不需要逐顆地檢查，不只能縮短整個製程的時間，也能減少人力成本的支出。雷射參數經過最佳化後，最小線路寬度誤差在±50 μm，線路的位置精準度則在±50 μm內，訊號的正確性和可靠度皆會提升。此外，本計畫能藉由雷射進行圖案化修整，將能使陶瓷元件進行頻率位移與效率提升，有助於解決陶瓷材料之成份差異而造成元件頻偏之問題。

關鍵字

微波介質陶瓷 ； 陶瓷雷射金屬化 ； 雷射雕刻

並列摘要

In this study, laser patterning and electroless copper plating were used to metallize microwave dielectric ceramics. The process temperature of the metallization was lower than other process methods such as Low Temperature Co-fired Ceramics (LTCC) and Direct Bond Copper (DBC), showing that this technology can effectively reduce the energy consumption and significantly reduce the cost for cooling equipment. In addition, compared with conventional silver paste sintering method, this process produces no short circuit or incomplete metallization in the wall of the holes. Therefore, after completing ceramic metallization process for different batches, it is not necessary to inspect individual devices. The process not only shortens the entire process time but also reduces labor cost. By optimizing laser parameters, the minimum line width error is within ±50 μm and the line position accuracy is within ±50 μm. The accuracy and reliability of the signals are also improved through the parameters optimization. In addition, this study shows that laser-pattern-trimming can be used to tune the frequency of ceramic device and improves its efficiency, allowing to solve the frequency deviation problem caused by the composition difference of ceramic materials.

並列關鍵字

Microwave dielectric ceramics ； Ceramics laser metallization ； Laser engraving