電漿深蝕刻設備及其製程技術

Introduction of Plasma Deep Etching Equipment and Process Technology

林冠宇 ； 張家豪 ； 沈家志 ； 劉志宏

《機械工業雜誌》 426期 (2018/09) Pp. 55-61

摘要

因應元件功能提升，3D IC封裝通孔(Via)、晶圓薄化切割(dicing)及微機電系統(MEMs)厚膜深蝕刻製程需求，關鍵蝕刻製程面臨挑戰。工研院機械所自行建置一智慧化電漿蝕刻設備，可控制蝕刻輪廓，同時能搭配製程參數蒐集與分析技術，進行高深寬比蝕刻製程。在本文中將介紹目前電漿深蝕刻設備建置現況與初步深蝕刻製程驗證結果。

關鍵字

深蝕刻 ； 反應性離子蝕刻 ； 靜電吸盤

並列摘要

In response to function increase in components, process demands for via holes in 3D IC package, wafer thinning, and micro-electromechanical systems (MEMs) also increase; thus the need for thick-film etching and high-aspect-ratio etching process increases. However, traditional etching process encounters some challenges. A smart plasma etching equipment was built by ITRI MMSL to control the etching profile, and the system also integrates process parameter collection and analysis technology to perform high-aspect-ratio etching process. In this paper, the current status of plasma deep etching equipment and the verification results of preliminary deep etching process will be presented.

並列關鍵字

Deep etching ； Reactive ion etch ； RIE ； Electrostatic chuck ； ESC