3D結構電子先進製造技術

Advanced Manufacturing Technology of 3D Structure Electronics

黃萌祺 ； 楊捷 ； 鄭文欽 ； 呂文鎔 ； 陳玠錡

《機械工業雜誌》 451期 (2020/10) Pp. 47-53

摘要

現今的電子產品發展趨於微型化，並且功能也日益增加，因此金屬線路與元件亦須朝著高密集度、3D結構且輕薄化的方向發展，故將電子電路及其零組件整合至立體結構件形成3D結構電子為重點發展趨勢，目前在智慧結構件、通訊電子、車用電子及醫療電子等領域皆擁有高度的需求。本文將介紹工研院開發之3D結構電子關鍵技術，利用智慧化3D元件接合技術與局部低溫金屬焊接技術，並配合LIM（Laser Induced Metallization）3D線路製造技術，達到高精度3D結構電子製作之目的。

關鍵字

三維結構電子 ； 三維接合技術 ； 三維線路

並列摘要

Nowadays, the development trend of electronic products focuses toward miniaturization, increase of functionalities increase, high density circuits and components, three-dimensional (3D) structure, and thin and light-weight. Therefore, the key development trend is to integrate electronic circuits and their components into a 3D structural electronics. Currently, there is a high demand in 3D structure electronics for smart structural parts, communication electronics, automotive electronics, and medical electronics. This article introduces the key technologies of 3D structure electronics developed by the Industrial Technology Research Institute, the key features include intelligent 3D component bonding technology, local low-temperature metal welding technology, and combining LIM (Laser Induced Metallization) 3D circuit manufacturing technology to achieve the goal of high-precision 3D structure electronic production.

並列關鍵字

3D structure electronics ； 3D bonding technology ； 3D circuit

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