非線性雷射改質高深寬比玻璃成孔技術

Nonlinear Laser Modification of Glass Substrates for Fabrication of High Aspect Ratio Through-Glass Vias

周府隆 ； 張芯語 ； 黃建融 ； 林于中

《機械工業雜誌》 479期 (2023/02) Pp. 12-19

摘要

因IC發展需求，玻璃成孔（Through Glass Via, TGV）技術將展現更多優勢。在TGV製程中，玻璃經由雷射多光子改質，可提高蝕刻效率且形成超高深寬比之玻璃成孔。本文將探討以非線性改質進行選擇性蝕刻之玻璃成孔技術。

關鍵字

玻璃成孔 ； 非線性 ； 改質

並列摘要

To meet the demands of integrated circuit development, the through glass via (TGV) fabrication technology shows more advantages. In the TGV process, the glass is modified by laser multi-photon, which can improve the etching efficiency and form TGV with ultra-high aspect ratio. This article will discuss the technology of TGV fabrication process by nonlinear multi-photon modification for selective etching.

並列關鍵字

Through glass via ； Nonlinear ； Modification

參考文獻

F. Shoo and S. Kumar, “System-in-Package Technology and Market Trends 2020,”Yole Developpement, 2020.

G. Park, K. Cho, K. Son, H. Park, et al., “Design and measurement of a 28 GHz glass band pass filter based on glass interposers for 5G applications,” EDAPS., 1-3, 2019.

S. Hwangbo, Y. Yoon and A. Shorey, “Glass interposer integrated dual band millimeter wave TGV antenna for inter-/intra chip and board communications,” APSURSI., 1639-1640, 2016.

S. Takahashi, K. Horiuchi, K. Tatsukoshi, M. Ono, N. Imajo and T. Mobely, “Development of Through Glass Via (TGV) formation technology using electrical discharging for 2.5/3D integrated packaging,”2013 IEEE 63rd Electronic Components and Technology Conference, 348-352, 2013.

S. W. Yoon, S. Y. L. Lim, A. G. K. Viswanath, S. Thew, T. C. Chai and V. Kripesh, “Reliability of a silicon stacked module for 3-D SiP microsystem,” IEEE Trans. Adv. Packag., 31(1), 127-134, 2008.