矽基板應用於發光二極體封裝之熱分析

Thermal Analysis of LEDs Packaging with Silicon Substrate

湯孟翰(Meng-Han Tang)

指導教授 ： 蘇國棟

國立臺灣大學/電機資訊學院/光電工程學研究所/碩士(2008年)

https://doi.org/10.6342/NTU.2008.00269

摘要

發光二極體近年來已經大量被應用在日常生活中，舉凡交通號誌燈、戶外顯示板、近年來已成為手機背光源的主流。可以預知，發光二極體在未來的應用上，將逐步取代傳統光源，成為大型顯示器的背光源，甚至進入每個家庭，形成主流的一般照明設備。
但是隨著發光強度越來越大，所需通入的電流也隨之增大，從以往的經驗公式（發熱功率=

關鍵字

矽基板 ； 熱阻抗 ； 多晶粒 ； 發光二極體封裝

並列摘要

Light Emitting Diodes (LEDs) have been used in daily life broadly, such as traffic light, signboard display, etc.. Recently, it has been the trend applied LEDs for backlight source of the cellular phones. Refer to this, we could forecast that LEDs would take the place of traditional light sources and turn into backlight source of the large-size display panels. Moreover, it might be the mainstream as daily illumination system in the future.

As the current is getting higher and higher, we can infer from the formula, Ρ=Ι^2×R, the more and more energy will transfer to the heat. However, LEDs are the devices that are not heat-resistant. When the temperature between the PN junction is above the rated temperature, the transfer efficiency from input power to light will decrease rapidly. Then, the whole system will be in a status of positive feedback. Finally, LEDs will burn due to overheatness.

Accordingly, to solve the issue about the heat is indeed the need. In my research, to choose appropriate material for package, and to testify the relation between parameters and temperatures are the major topics in order to manage the thermal problem when the LED is overheated.

Base on recent reports, using silicon as the substrate which LED die placed on can lower the thermal resistance as a whole due to good thermal conductivity. By the way, because the silicon is non-metal material, the thermal expansion coefficient does match better that of the LED’s. In case of high temperature, the thermal stress and the deformation will be much smaller compared to using metal materials. Moreover, when it comes to multi-chip, pairs of electrodes can be fulfilled by some means directly in silicon or non-metal substrate. Consequently, it is good for enhancing the reliability of the LED package by using silicon substrate.

並列關鍵字

Silicon substrate ； Thermal resistance ； Multi-chip ； LED Packaging

參考文獻

[1] M. Arik, C. A. Becker, S. E. Weaver, and J. Petroski, "Thermal management of LEDs: package to system," Proceedings of SPIE, vol. 5187, p. 64, 2004.

[2] M. Arik, J. Petroski, and S. Weaver, "Thermal challenges in the future generation solid state lighting applications: light emitting diodes," Proc. IEEE Intersociety Conf. Thermal Phenomena, pp. 113-120, 2002.

[3] M. Arik, S. Weaver, C. Becker, M. Hsing, and A. Srivastava, "Effects of Localized Heat Generations Due to the Color Conversion in Phosphor Particles and Layers of High Brightness Light Emitting Diodes," ASME/IEEE International Packaging Technical Conference and Exhibition, Hawaii, USA, pp. 611-619, 2003.

[5] J. Petroski, "Thermal challenges facing new-generation light-emitting diodes (LEDs) for lighting applications," Proceedings of SPIE, vol. 4776, p. 215, 2002.

[6] J. J. Huang, Solid State Lighting, NTU GIPO.