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  • 學位論文

利用射頻磁控濺鍍法製備P-type Bi0.5Sb1.5Te3 和N-type Bi2Te2.7Se0.3熱電薄膜於PI軟性基板之熱電性質研究

The Study of P-type Bi0.5Sb1.5Te3 and N-type Bi2Te2.7Se0.3 Thermoelectric Thin Films on PI Substrate by RF Magnetron Sputtering

指導教授 : 林新智
共同指導教授 : 林明志
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摘要


Bi2Te3系列化合物為室溫下最佳的熱電性質之材料,依參雜不同的元素可分為P-type Bi0.5Sb1.5Te3 和N-type Bi2Te2.7Se0.3。本實驗利用射頻磁控濺鍍方式製備P-type Bi0.5Sb1.5Te3 和N-type Bi2Te2.7Se0.3熱電薄膜在PI基材上,並改變射頻功率、工作壓力、基材溫度為實驗參數,以得到最佳的熱電特性。並進行XRD、XPS、霍爾效應以及Seebeck效應的量測分析。 P-type Bi0.5Sb1.5Te3方面發現在室溫下,工作壓力為5 mTorr且射頻功率18 W得到之熱電薄膜並於270度下通電流退火5分鐘後可以得到最佳的熱電特性,其Seebeck係數為220.5 μV/K,電阻率則會大幅降低至5 mΩ•cm,熱電功率因子可達到9.59 μW/K2cm。 N-type Bi2Te2.7Se0.3方面發現在基材溫度250度下,工作壓力5 mTorr且射頻功率15W,得到之熱電薄膜並於270度下通電流退火5分鐘後可以得到最佳的熱電特性,其Seebeck係數為177.65 μV/K,電阻率則會大幅降低至3.264x10-2 Ω•cm,熱電功率因子可達到4.158 μW/K2cm。

並列摘要


Bismuth telluride-based compound is currently widely used in thermoelectric material due to its excellent thermoelectric performance around room temperature. By doping different elements, P-type Bi0.5Sb1.5Te3 and N-type Bi2Te2.7Se0.3 can be made. The thermoelectric thin films of Bi0.5Sb1.5Te3 and Bi2Te2.7Se0.3 on polyimide substrates are prepared by radio-frequency (RF) magnetron sputtering. The Bi0.5Sb1.5Te3 and Bi2Te2.7Se0.3 thin films are deposited with different substrate temperature, work pressure and RF power by radio-frequency (RF) magnetron sputtering. Finally, this research analyses the themoeleletric performance, crystal structure and composition by XRD, XPS, Hall effect and the Seebeck effect. This research discovers that the P-type Bi0.5Sb1.5Te3 thermoelectric thin films show the best thermoelectric properties at room temperature with 18 Watts of RF working pressure under 5 mTorrs after electrical annealing treatment at 270 degrees Celsius for 5 minutes;The Seebeck coefficient is 220.5 μV/K, the lowest electrical resistivity is 5 mΩ∙cm, and the highest power factor is 9.59 μW/K2cm. N-type Bi2Te2.7Se0.3 thermoelectric thin films show the best thermoelectric properties at room temperature with 15 Watts of RF, working pressure under 5 mTorrs after electrical annealing treatment at 270 degrees Celsius for 5 minutes and the Seebeck coefficient is 177.65 μV/K,the lowest electrical resistivity is 3.264x10-2 Ω∙cm and the highest power factor is 4.158 μW/K2cm.

參考文獻


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[10] J.A.Thornton, “Influence of Apparatus Geometry and Deposition conditions on the Structure and Topography of Thick Sputtered Coatings”, Journal of Vacuum Science & Technology Archives, 11(4), p. 666, 1974.

被引用紀錄


陳俞亘(2016)。單晶硒化錫的熱電性質之探討〔碩士論文,國立臺灣大學〕。華藝線上圖書館。https://doi.org/10.6342/NTU201602047

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