雷射退火技術應用於柔性基板上的P型碲化鉍薄膜之熱電性質改善

隨著科技的發展，穿戴式微型感測器的應用也越來越廣泛，而電力的續航問題是一個重要的關鍵，因此必須發展不使用電池但為柔性基材的發電裝置，而薄膜熱電材料為眾多發電裝置中的候選人，雖然其發電效率與商業化相比還有一段差距，但將熱電薄膜結合到穿戴式感測器也為一個創新的構想。本研究中我們透過濺鍍沉積熱電薄膜在PET基板上，接著利用532 nm連續波雷射退火進行薄膜的優化，在不破壞薄膜的前提下，利用雷射功率與掃描速度的相互配合以及掃描次數的應用，找出最佳的加工參數為雷射功率240 mW、掃描速率120 mm/s、掃描次數30次，成功的讓熱電薄膜的電阻率下降了快60%，Seebeck 係數也從155 μV/K 上升至175 μV/K。接著利用功率因子與最大功的計算，發現經過雷射退火後的功率因子從0.32 μ"W/cm*" "K" ^"2" 上升到0.8 μ"W/cm*" "K" ^"2" ，最大輸出功從0.68 nW到1.9 nW，另外透過彎曲試驗證實本實驗所製作的熱電薄膜在彎曲半徑為8 mm時經過1000次的彎曲之後還能保有一定的電阻值，成功展現出可撓式元件的特性。

關鍵字

連續波雷射退火；濺鍍沉積；熱電薄膜；柔性基板；席貝克係數

並列摘要

With the vigorous development of wearable electronic devices, thermoelectric materials have a certain potential on wearable devices, which can replace batteries and allow devices to be used through electricity generated by temperature differences. Therefore, how to deposit the thermoelectric film on a flexible substrate and optimize its thermoelectric properties through a certain processing method has become the focus of this experiment. In this study, we deposit Bi2-xTe3Sbx thermoelectric films on PET flexible substrates by sputtering deposition and annealing it in the atmosphere by continuous wave laser (λ=532nm) scanning system. We can find the best processing parameters by changing the laser power, scan speed and scan times. Finally, we successfully use laser annealing to reduce the resistivity by 60% and increase Seebeck coefficient. The power factor increase from 0.32 μW/cm*K^2 to 0.8 μW/cm*K^2 . At last it is confirmed through bending test that the component can maintain the normal working range under 1000 bending at radius of 8 mm.

並列關鍵字

Continuous wave laser annealing ； Sputtering deposition ； Thermoelectric film ； Flexible substrate ； Seebeck coeffieient

參考文獻

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雷射退火技術應用於柔性基板上的P型碲化鉍薄膜之熱電性質改善

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