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  • 學位論文

具渦旋結構散熱板之熱傳分析

Thermal Analysis of Cold-Plates with Swirling Cavities

指導教授 : 周賢福

摘要


本文藉由理論分析與實驗量測探討具渦漩結構的中央處理器散熱裝置(CPU散熱塊),在不同冷卻流道幾何與體積流率下之散熱效能,未來可應用於電子元件之散熱上。經由明顯的物理現象做出合理的假設,可預測渦旋結構自發加速性對熱傳效率之影響及經驗式的概略結構,再經由充分的實驗數據支持假設的可靠性。藉由在文中對控制體積、初始條件、模型修正之物理假設,將渦旋腔各種不同的幾何條件,及工作流體的控制條件加以分析,可直接自理論預測渦漩結構散熱裝置之熱傳效率。本研究所進行之實驗與理論相互比較,亦應證了理論之趨勢。藉由軟體之輔助,可求得無因次化熱傳效率與流速之趨勢分布。最後,本文期望建立可適用於不同幾何尺寸之渦旋結構流場的熱傳效率經驗式,便於未來渦旋結構流道設計者分析渦旋流場。

並列摘要


Recently, high-performance electronic devices generated more heat than former. Mini-channel liquid coolers should be studied, to dissipate heat generated by the high-power electronic devices. In this research, the performances of swirling-cold-plates with different channel designs by using water as the cooling fluid were studied with different flow rate.. The results of experiment were measured and analyzed. The influence of the swirling structures on the heat transfer efficiency of liquid-cooling cold-plate can be predicted under some reasonable assumptions. The theoretical predictions were well verified by experimental analyses. The nondimensional relationship between heat transfer coefficient and relative parameters can be established during a lot of precision experiments. These parameters include geometric structure of swirling channel, properties and flow rate of cooling fluid, and heat dissipation rate demanded.

參考文獻


[1]H. Matsushima, S. Matsushita, I. Asano, T. Takeuchi, O. Suzuki, US Patent 20050126752A1.
[6]J. A. Valenzuela, US Patent No. US20010050162A1.
[9]H.Y. Zhang, T.N. Wong, Y. K. Joshi,“Development of Liquid Cooling Techniques for Flip Chip Ball Grid Array Packages With High Heat Flux Dissipations,” IEEE Trans. Compon., Packag., Manufact. Technol. Vol. 28, No. 1, pp. 127-135, March 2005.
[11]Y. Murakami, B. B. Mikić,“Parametric Optimization of Multichanneled Heat Sinks for VLSI Chip Cooling,” IEEE Trans. Compon., Packag., Manufact. Technol. Vol. 24, No. 1, pp. 2-9, March 2001.
[12]C. Y. Liu and Y. H. Hung, “Heat Transfer and Flow Friction Characteristic for Compact Cold Plates,”Journal of Electronic Packaging, Trans. ASME, Vol. 125, No. 1, pp. 104-113, 2003.

被引用紀錄


李明軒(2008)。具渦旋結構散熱板之數值模擬分析〔碩士論文,國立臺灣大學〕。華藝線上圖書館。https://doi.org/10.6342/NTU.2008.01293

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