堆疊晶片間無線能量傳送系統

Wireless power transmission system between stacked dies

連芳儀(Fang-Yi Lian)

指導教授 ： 盧信嘉

國立臺灣大學/電機資訊學院/電子工程學研究所/碩士(2013年)

https://doi.org/10.6342/NTU.2013.02057

摘要

本篇論文提出一個使用了耦合電感於三維積體電路堆疊晶片間無線能量傳輸的一個可行方法。現行無線能量傳輸方法主要有三，耦合電容、耦合電感以及天線。但其中耦合電容與天線在晶片尺寸時的功率傳輸大約只在微瓦(μW)等級，而我們希望能得到毫瓦(mW)等級的傳輸功率，來驅動系統級的電路。除此之外，與電容耦合相比，由於電感耦合的傳輸有比較遠的距離，因此選用耦合電感做為傳輸媒介。本論文提出一種匹配方式來提升電感傳輸的效率，包含如何選取較好的匹配方式匹配至整流器。我們使用交流弦波做為發射訊號，經由發射端電感來傳送能量，接收端則包含了接收電感以及整流器來穩定並提供輸出電壓。此無線能量傳輸系統發射端使用玻璃基體被動元件(glass integrated passive device, GIPD)製程，而接收端方面則使用台灣積體電路公司0.18微米CMOS製程來實現。本論文，模擬結果為輸出功率4.7mW，轉換效率包含整流器為34.89%。

關鍵字

三維積體電路 ； 耦合電感 ； 能量傳輸 ； 覆晶技術 ； 電感匹配 ； 整流器

並列摘要

A wireless power transmission system for stacked dies in 3D-IC is implemented by using coupled inductors. There are three common methods for wirelessly power transfer: inductive coupling, capacitive coupling and antenna radiation. We hope the wireless power transmission system can offer more than mW power. Unfortunately, only inductive coupling can provide over mW power transmission. Besides, inductive coupling interconnect has longer transmission distance as compared with capacitive interconnect. This is why we choose inductive coupling. In this thesis, we propose an impedance matching method to improve the efficiency of inductive transmission, including how to select a better matching point for the rectifier. A sine-wave signal generator is adopted as a source for power transmission. On the other side, there is a receiving inductor and a rectifier at the receiver. The proposed receiver of wireless power transmission system is implemented in TSMC 0.18μm CMOS process and the transmitter of wireless power transmission system is implemented in GIPD process respectively for demonstration of this architecture. The simulated received power and efficiency for transmitting inductor including rectifier are 4.7mW and 34.89% respectively.

並列關鍵字

3D-IC, ； coupled inductor ； power transmission ； flip-chip ； inductor matching ； rectifier

參考文獻

[17] 郭向宸, "直線耦合電感的特性研究與計算," 國立台灣大學 , 國立台灣大學

[31] 紀俊安, "堆疊晶片間無線能量傳送系統," 國立台灣大學 , 國立台灣大學電

[1] International Technology Roadmap for Semiconductors 2007 Edition Assembly

and Packaging. Available: http://www.itrs.net/Links/2007ITRS/Home2007.htm

"Chip-to-chip inductive wireless power transmission system for SiP