The rapid progress in microlithography technologies behind Moore’s law has been kept for half a century. Electron-beam lithography is a very potential technique, and could become the main force of manufacture in the future. But it is still have some defects like proximity effect. In this project, we first introduced the background of lithography, and further more introduced the electron-beam lithography. The electron-beam lithography is limited in electron scattering. We first use the convolution form of system identification technique to find the energy distribution. Furthermore, we also propose a model-based electron proximity effect correction by shape modification. We use different test pattern in electron proximity effect correction and make the error between desired pattern and wafer pattern is much smaller.