In this thesis, the basic concepts of mechanical/package strain technique and optical communication system are described. Then the focus will be on the construction and performance enhancement of the photo sensing device and analog circuit in the optical communication system receiver front-end. In chapter 3 and chapter 4, a photodetector with NMOS diode structure and a transimpedance amplifier (TIA) adopting NMOSFET active inductor are designed, and through tensile strain, their responsivity and bandwidth can be enhanced respectively. Chapter 5 introduces another transimpedance amplifier designed for high speed applications. Finally, in chapter 6, a novel SiGe HBT BiCMOS type active inductor is discussed and simulated.