Sn-XAg-0.5Cu-0.04Ni-0.5Ce 銲錫球格陣列構裝界面反應研究

本研究分為兩部分，第一部分主要針對Sn-xAg-0.5Cu-0.04Ni（x = 0.1, 1, 2, 3wt%）不同Ag含量之銲錫合金與化金（Au/Ni-P/Cu）基板做接合，經過時效處理後，觀察其界面反應金相與接點強度及銲錫機械性質之研究。隨著Ag含量越多，銲錫基地中之Ag3Sn介金屬量越多，且接點強度亦隨Ag含量的增加而提高。在拉伸試驗方面，隨著Ag含量越多且分散於基地中，具有散佈強化之作用，進而提升強度值；此外，延展性則因Ag3Sn介金屬量增加影響差排移動，隨著Ag含量的增加使得延展性下降。在接點界面反應方面，Ag含量的多寡並不影響界面介金屬的型態以及成長速率。第二部分則是在低Ag含量之Sn-1Ag-0.5Cu-0.04Ni銲錫中添加0.5wt%Ce的稀土元素及添加完Ce稀土元素後再添加0.2wt%Zn，分別以此三種銲錫與化金基板做接合，針對接點之界面反應與銲錫特性做研究。研究結果顯示：不論添加0.5wt%Ce稀土元素或是0.2wt%Zn過渡元素皆不會對Sn-1Ag-0.5Cu-0.04Ni銲錫合金之熔點產生影響。在觀察Sn-1Ag-0.5Cu-0.04Ni-0.5Ce銲錫微結構，可以看到粗大的CeSn3介金屬化合物，這些CeSn3介金屬化合物因為過於粗大而導致銲錫接點強度下降。雖然粗大的CeSn3介金屬化合物會使銲錫的機械強度下降，但卻可使銲錫合金的延展性獲得提升，推測這是因為破裂模式的轉變所造成。另外在Sn-1Ag-0.5Cu-0.04Ni-0.5Ce銲錫添加0.2wt%Zn可以細化銲錫中的CeSn3介金屬，使得銲錫接點強度與銲錫合金的抗拉強度皆獲得提升。再接點之界面反應方面，不論添加Ce或是Zn對接點之介金屬的成長皆有抑制的效果，而介金屬成長機制皆屬於擴散控制。

關鍵字

稀土元素； Ag含量；無鉛銲錫；界面反應；介金屬化合物

並列摘要

This research is divided into two parts, the main focus of first part is the effect of different Ag content on the physical and mechanical performance, such as melting points, microstructure, interfacial reactions, bonding strength, tensile properties, between Sn-Ag-Cu-Ni solder and electroless nickel-immersion gold-plated Cu substrate during aging. As Ag content being the more, the more Ag3Sn intermetallic compound in the solder matrix, and the strength of joint is also improved with increasing of Ag content. In tensile test, the strength of the solder alloy increases with increasing of Ag content. In addition, the dislocation migration is resisted by Ag3Sn intermetallic compound, and the ductility of solders decreases with increasing of Ag content. In interface reaction, the number of Ag content does not influence the interfacial reaction type and growth speed of intermetallic compound. Second part of this thesis is the effect of the adding of Ce element on the physical and mechanical performance, such as melting points, microstructure, interfacial reactions, bonding strength, tensile properties, between Sn-1Ag-0.5Cu-0.04Ni solder and electroless nickel-immersion gold-plated Cu substrate. The result of study reveals: No matter adding 0.5wt%Ce rare-earth element or 0.2wt%Zn element will not influence the melting point of Sn-1Ag-0.5Cu-0.04Ni solder. The thick CeSn3 intermetallic compound is observed in the microstructure of Sn-1Ag-0.5Cu-0.04Ni-0.5Ce solder. Because these CeSn3 intermetallic compounds is too thicker to decrease the strength of solder joint. Although the thick CeSn3 intermetallic compounds decrease the mechanical strength, the ductility is enhanced. In addition, adding 0.2wt%Zn into Sn-1Ag-0.5Cu-0.04Ni-0.5Ce solder alloy can not only refine the CeSn3 intermetallic compound but also improve the mechanical properties and bonding strength of solder joints. The addition of Ce and Zn into Sn-1Ag-0.5Cu-0.04Ni solder alloy can inhibit intermetallic compound layer growth of the joint. All the mechanism of intermetallic compound layer growth is diffusion controlled.

並列關鍵字

rare-earth element ； Ag content ； Pb-free solder ； interfacial reaction ； intermetallic compound

參考文獻

65. 林修任, “含稀土銲錫合金接點之界面反應、電遷移與錫鬚成長研究”, 2007,台灣大學博士論文, 指導教授：莊東漢

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2. S. Herat, “Green Electronics through Legislation and Lead Free Soldering”, Clean 2008, Vol. 36 (issue 2), pp.145–151

3. J.W. Yoon, S.W. Kim, S.B. Jung, “IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate”, Journal of Alloys and Compounds, 2005, Vol. 392, pp.247–252

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Sn-XAg-0.5Cu-0.04Ni-0.5Ce 銲錫球格陣列構裝界面反應研究

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