熱虹吸蒸氣腔體之研究

Investigation and Analysis of the Thermosyphon Vapor Chamber

陳宏鳴(Hung-Ming Chen)

指導教授 ： 陳希立

國立臺灣大學/工學院/機械工程學研究所/碩士(2004年)

https://doi.org/10.6342/NTU.2004.01537

摘要

本研究將應用沸騰時高潛熱之熱傳概念，設計出一種新型的散熱裝置：熱虹吸蒸氣腔體（Thermosyphon Vapor Chamber），將其與風扇相搭配，成為一散熱模組。以實驗方式研究其對於加熱率、工作流體充填量及沸騰表面型式此三種變數下之散熱效果，並找出散熱能力最佳、穩定性最高之最佳化設計，同時建立起本實驗各部份之理論模式及半經驗公式，以冀帶給後人更進一步的研究方向。
實驗結果發現，熱虹吸蒸氣腔體之整體散熱性能主要取決於蒸發熱阻及冷凝熱阻。隨著加熱率增加，會使得蒸發熱阻降低、冷凝熱阻上升，但整體而言總熱阻仍下降。於充填量為12.9㏄及17.3㏄時系統可持續穩定操作；當充填量為8.6㏄時E1002及E1402表面出現溢流現象，使得散熱性能降低；充填量過高將使得系統散熱性能變差。E1002及E1402蝕刻沸騰表面有助於增強沸騰熱傳遞；E0602蝕刻沸騰表面由於間距過小，使得散熱性能變差。兩相封閉式熱虹吸蒸氣腔體散熱模組於沸騰表面為E1020、充填量17.3㏄時，散熱能力最佳，在加熱率為80W時，各項熱阻及總熱阻值最小（0.527℃�W），較同充填量下光滑銅平板沸騰表面約低25％。

關鍵字

蒸氣腔體 ； 熱虹吸管 ； 平板型蒸發器

並列摘要

The research applies the concept of high latten heat of boiling liquid to design a new type of heat removal device: “Thermosyphon Vapor Chamber, TSVC” and combine it with fans to make it a heat removal module. The system heat removal ability was studied under three different variables: （1）heating rate, (2)filling ratio of working fluid , and (3)types of boiling plate through the experiment method. Simultaneously, theory models and semi-experimental correlations of all parts of the system were established to bring further steps to researchers, too.
The experimental results showed that the heat removal ability of TSVC was determined by evaporating resistance and condensing resistance. As the heating rate increased, evaporating resistance became lower and condensing resistance became higher, but the total resistance was lower in a whole. The system can be operated steadily while the filling ratio were 12.9㏄and17.3㏄. Flooding phenomenon was occurred in E1002 and E1402 etching plates while the filling ratio is 8.6㏄,its made the heat removal ability of system become lower, and the heat removal ability of system became lower while the filling ratio was too much, too. The boiling heat transfer rates was increased by the etching plates of E1002 and E1402.
The heat removal ability of TSVC in this research was highest under E1002 etching plate and the filling ratio was 17.3㏄, all kinds of resistances and total resistance got a lowest value（0.527℃/W）, which was 25％higher than smooth copper plate in the same conditions.

並列關鍵字

Vapor Chamber ； Thermosyphon ； Plate Evaporator

參考文獻

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